Qualcomm MDM9250 Snapdragon X16 LTE Modem Digital Functional Analysis - Functional Analysis Report

Product Code

FAR-1704-801

Release Date

17/07/2017

Availability

Published

Product Item Code

QUA-MDM9250

Device Manufacturer

Qualcomm

Device Type

Communications IC

Subscription

Logic

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Qualcomm MDM9250 Snapdragon X16 LTE Modem Digital Functional Analysis - Functional Analysis Report

This report presents a Digital Functional Analysis of the Qualcomm HG11-NV960 die found inside the Qualcomm MDM9250 package. This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI gate, contacts and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

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