Interested in this report?

Published: 17 July 2017


This report presents a Digital Functional Analysis of the Qualcomm HG11-NV960 die found inside the Qualcomm MDM9250 package. This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI gate, contacts and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

Report Description

This report presents a Digital Functional Analysis of the Qualcomm HG11-NV960 die found inside the Qualcomm MDM9250 package.

Recent OMR Reports

EXR-1810-801  |   Published: 3 October 2025
EXR-1810-801 - NXP NFC Controller 100VB27 - Apple iPhone Xs Exploratory Report
CWR-1711-902  |   Published: 16 January 2019
FAR-1811-806  |   Published: 16 January 2019
This report presents a Basic Floorplan Analysis of the Microchip Technology BT5506A found inside the Microchip Technology IS2064GM-0L3 package. The IS2064GM-0L3 package was extracted from the Audeze Mobius...