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In TechInsights' Chip Observer, a publication dedicated to monitoring the semiconductor market from production facilities to consumer endpoints, the focus of this article is sustainability.
TechInsights has identified Samsung's revolutionary 3nm gate-all-around (GAA) process within the Whatsminer M56S++ crypto-mining ASIC from Chinese manufacturer MicroBT.
The Apple A16 Application Processor, powering the iPhone 14 Pro and 14 Pro Max, features groundbreaking advancements in performance and efficiency, including the introduction of the LPDDR5 interface with a new RDQS lane. A recent circuit analysis by TechInsights highlights these impressive developments.
The Sony IMX500 is an image sensor that detects, recognizes, and classifies objects and events independently, without relying on a cloud or server connection. A game-changer in the market of mobile processors and AI video processors.
Curious about the latest breakthroughs in battery technology? Look no further than Tesla’s new 4680 battery cells. These innovative cells are designed to not only be larger and more energy dense, they also have a hidden feature: three terminals instead of the standard two.
Last summer, TechInsights’ experts discovered that Semiconductor Manufacturing International Corporation (SMIC) used 7nm technology to manufacture the MinerVa Bitcoin Miner system-on-chip (SoC).
Discover our latest eBook on the Google Pixel Watch. Our subject-matter experts analyze the trajectory of the global smartwatch market, forecast Google’s position, and examine component costing related to the addition of the cellular radio.
Silicon Bridge Disruptor: SPIL enters the race with a new offering found in AMD MI210
The BeyonSense Short Wave Infra-Red (SWIR) Sensor is part of a new generation of image sensors that capture light beyond the visible spectrum enabling imaging and sensing devices to see beyond the visible spectrum and into the internal structure of an object.
Apple’s H2 BT 5.3 audio SoC – elevating the audio experience in the AirPods Pro 2
New Broadcom BCM59365, featuring the most advanced wireless charging PMIC observed to date.
Download this disruptive event brief to get detailed die images of Xtacking 3.0, further information about our planned analysis, and a comparison table showing YMTC’s three most recent solutions, 128L CDT1B (August 2021), 128L CDT2A (November 2022), and 232L EET1A.
MediaTek’s Dimensity 1050 chipset is making 5G mmWave support in smartphones more affordable. Until now, only top tier US devices were equipped with 5G mmWave capabilities.
Security and surveillance camera equipment is frequently required to perform in challenging lighting conditions. Based on multiple customers demands for performance upgrades to their STARVIS system, Sony have developed the IMX662, the latest from the STARVIS 2 family of image sensors.
Samsung’s HKMG DDR5 is the most advanced DRAM product available. Based on the successes of this device design, HKMG is likely set to become the new standard in DRAM manufacturing. Learn more about this technology innovation here.
TechInsights has just received the Motorola Moto X30 Pro (XT2241-1) smartphone and launched an analysis on its wide-angle rear camera, confirming the Samsung HP1.
Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies. Our analysis also uncovered many similarities between the SMIC 7nm and the TSMC 7nm, which are available in our comparison brief.
TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.
Both leading foundries allowed customers to claim they were using a 4nm process when, in fact, they were using 5nm technology. This situation renders node names meaningless. Featured in our July 22 Microprocessor Report we are making this available, in full, for a limited time.
A collaboration between Dr. Stephen Russell (TechInsights) and Prof. Peter Gammon (PGC). ROHM released their 4th generation (Gen 4) MOSFET products this year. The new range includes MOSFETs rated to 750 V (increased from 650V) and 1200 V, with a number of the available TO247 packaged components automotive qualified up to 56A/24mΩ.
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