Technical Report: Samsung SE913B PMIC Floorplan Analysis

Client compute packaging evolves with AI‑driven performance needs, covering 2D, 2.5D, and 3D architectures and chiplet adoption trends.

The client compute market is comprised of desktop PCs, including high-end desktops (HEDTs)/workstations, and notebook PCs. Personal computing is a mature market, but there is a shift underway to AI-enabled machines, which is driving higher performance requirements as well as requiring advanced thermal management. By 2030, a majority of the market will be AI-enabled. The main processors for these devices incorporate multiple cores, and some designs are moving to chiplets. This has implications for the packaging of these processors, as trends from the high-performance computing sectors trickle down to the client level. This report covers the major packages in use, including 2D, 2.5D, and 3D and provides a forecast for how client computing CPU packaging will evolve over the forecast period.