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Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.

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Competitive Technology Intelligence

Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)

Platform for the Semiconductor Industry

TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics

Intellectual Property
 

Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products

Latest Report Analysis

This report presents a Device Essentials (DEF) summary of the SmartSensSC410GS, 1/1.3”, 4.0 MP, 4.2 μm Pixel Pitch Back-Illuminated Voltage Domain Global Shutter CMOS Image Sensor for Automotive and Intelligent Traffic System.
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
This report presents a digital floorplan analysis (DFR) of the Samsung E9925 Exynos 2200 application processor extracted from the Samsung S22 Ultra smartphone.
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."