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Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.

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Competitive Technology Intelligence

Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)

Platform for the Semiconductor Industry

TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics

Intellectual Property
 

Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products

Latest Report Analysis

This report presents a package analysis of the STMicroelectronics VG6640AB1M 1.3 MP CMOS image sensor used for automotive, security, and other outdoor applications.
This presents a power package analysis (PKG) of the GaN Systems GS-065-060-3-B 650 V GaN E-HEMT. The product features a low Rds(on) of 25 mOhm, competitive with leading SiC devices in terms of on-resistance. It utilizes ‘GaNPX’ technology for low inductance and thermal resistance for demanding high power applications. It is suited to a wide range of applications such as AC-DC and DC-DC power converters, renewable energy and industrial applications.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a memory floorplan analysis of the Micron MT61K512M32KPA-21_U 1z nm 8 Gb GDDR6X DRAM extracted from the EVGA RTX 3090 Ti graphics card.
This report presents an advanced packaging essentials (APE) analysis of the Apple M1 Ultra extracted from the Mac Studio M1 Ultra (A2615).
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules