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Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Accelerate your process with TechInsights' Logic Packaging Analytics
Are you finding the SoC and ASIC design challenging and time? It takes tremendous time and effort to build up knowledge of the industry, your competitors, your target market, and the product strategies of various SoCs. You may also need to understand critical competitive product benchmarks to achieve design efficiency and differentiation and to enhance your product's performance while optimizing for cost.
Disruptive Event - MediaTek’s Dimensity 1050 chipset AiP
Following up on MediaTek’s strong entry into the 5G mmWave market with their Dimensity 1050 chipset, TechInsights has discovered an innovative mmWave antenna array design in their MT6107O antenna-in-package (AiP) as used in the Moto Edge 2022, model XT2205-3 (Verizon edition), and not previously seen in AiP designs from Qualcomm, Murata, and Apple.
Webinar: Minimizing Battery Degradation in Smartphones
This webinar reviews the existing industry fast charging techniques used by Apple, Samsung, and Xiaomi in their recent flagship smartphones. It was observed that these smartphones benefit from adaptive charging algorithms to suppress battery degradation, which would generally result from the high applied current.
IoT Predictions for 2023
The Mobile channel at TechInsights recently published the annual IoT Predictions for 2023. TechInsights have identified 3 key technology trends and 2 key strategic trends which we expect will shape the IoT market in 2023 and beyond.
Tesla to Use 75% less SiC. Should SiC Stakeholders be Worried?
Tesla's recent announcement that they will reduce the amount of silicon carbide (SiC) in future vehicles by 75% is a significant move for the company, as SiC has been a key material in their vehicles' power electronics systems.
Samsung Galaxy S23 Ultra Cameras
TechInsights has conducted an initial teardown analysis of the Samsung Galaxy S23 Ultra, with a focus on the phone's camera modules and optical sensors. This blog presents the preliminary findings of the teardown, revealing the specific components and manufacturers of the camera and sensor hardware found inside the phone.Latest Report Analysis
This report presents an advanced memory essentials (AME) of the Fujitsu MB85R8M2TABGL-G 8 Mb FRAM.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a battery essentials (BEF) of the Sunwoda A2866 stacked pouch Li-ion battery, extracted from the Apple iPhone 14 Pro.
This report presents a Basic Floorplan Analysis of the Apple 225007 die found inside the Apple 225007 component. The 225007 component was extracted from the Apple MQD83AM AirPods.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a digital floorplan analysis (DFR) of the Nvidia Jetson AGX Orin AI SoC. The AGX Orin is designed for powerful AI computing in autonomous machines such as advanced robotics and other AI Edge applications. This report provides analysis of the IP blocks and other design features including the cell libraries used in the design of those block.