For over 25 years TechInsights has been a trusted patent and technology partner to the world’s largest and most successful companies including 37 of the top 50 U.S. patent holders. By revealing the innovation others can’t inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions.

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  • Lenovo Brings the New Snapdragon to Market
    Lenovo Brings the New Snapdragon to Market

    How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell out of 220,000 of their highly anticipated Lenovo Z5 Pro GT flagship phones. Luckily, we had some of our own good fortune.

    Technology Blog
    Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
    Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger

    Gallium Nitride (GaN) and Silicon Carbide (SiC) power solutions have been in the works from major manufacturers for years. TechInsights is excited to report that we have analyzed our first GaN-based commercial product in our labs. This blog provides an overview of our analysis of the RAVPower RP-PC104 USB-C charger, for which the full report is available through our new Power Semiconductor subscription.

    Technology Blog
    Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication
    Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication

    Tesla Motors announced that it has agreed to acquire Maxwell Technologies - a company that is best known for manufacturing ultracapacitors for energy, industrial and automotive applications – for $218 million.

    Patent Intelligence Blog
  • The Evolution of STMicroelectronics BCD Technology
    The Evolution of STMicroelectronics BCD Technology

    TechInsights has been monitoring the evolution of STMicroelectronics Bipolar-CMOS-DMOS (BCD) technology for more than fifteen years, beginning in the year 2000 when we performed a structural and electrical characterization of a 0.8 µm BCD device with a 1999 mask date.

    Technology Blog
    Google Pixel 3 XL Teardown
    Google Pixel 3 XL Teardown

    We found some interesting surprises in this phone, including: Google’s custom-designed Titan M security processor, STMicroelectronics wins the ambient light sensor socket, and STMicroelectronics wins the secure MCU socket.

    Technology Blog
    Fitbit Charge 3 Teardown
    Fitbit Charge 3 Teardown

    Fitbit Charge 3, a New Design Win for Cypress Semiconductor, and your New Year’s Resolutions

    Technology Blog
  • How China Took Over Your TV
    How China Took Over Your TV

    "Made in China" once often meant "assembled" there. Now it’s mastering the art of making everything.

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    A Look Inside MicroVision’s PicoP Projector Technology
    A Look Inside MicroVision’s PicoP Projector Technology

    MicroVision, based in Redmond WA, now in partnership with STMicroelectronics, has been a technology leader in the small form factor laser beam scanning (LBS) projector market.

    Technology Blog
    An Examination of LPWAN Technology in IoT
    An Examination of LPWAN Technology in IoT

    TechInsights looks into the four main low-power wide-area-network technologies from the reverse-engineering angle via semiconductor die analysis, and its place in the IoT market.

    Technology Post
Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication
Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication

Tesla Motors announced that it has agreed to acquire Maxwell Technologies - a company that is best known for manufacturing ultracapacitors for energy, industrial and automotive applications – for $218 million.

Patent Intelligence Blog
Creating Better Applications Through Patent Strengthening
Creating Better Applications Through Patent Strengthening

Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

Patent Intelligence Blog
What does Uber’s patent landscape look like?
What does Uber’s patent landscape look like?

The IAM blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years. TechInsights' Martin Bijman adds to the story with some competitive landscape analysis.

Patent Intelligence Blog
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Lenovo Brings the New Snapdragon to Market
Lenovo Brings the New Snapdragon to Market

How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell out of 220,000 of their highly anticipated Lenovo Z5 Pro GT flagship phones. Luckily, we had some of our own good fortune.

Technology Blog
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger

Gallium Nitride (GaN) and Silicon Carbide (SiC) power solutions have been in the works from major manufacturers for years. TechInsights is excited to report that we have analyzed our first GaN-based commercial product in our labs. This blog provides an overview of our analysis of the RAVPower RP-PC104 USB-C charger, for which the full report is available through our new Power Semiconductor subscription.

Technology Blog
The Evolution of STMicroelectronics BCD Technology
The Evolution of STMicroelectronics BCD Technology

TechInsights has been monitoring the evolution of STMicroelectronics Bipolar-CMOS-DMOS (BCD) technology for more than fifteen years, beginning in the year 2000 when we performed a structural and electrical characterization of a 0.8 µm BCD device with a 1999 mask date.

Technology Blog
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  • Intel 10 nm Logic Process Analysis
    Intel 10 nm Logic Process Analysis

    TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

    Latest Reports
    SK hynix 72L 3D NAND Analysis
    SK hynix 72L 3D NAND Analysis

    SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

    Latest Reports
    Micron 1x DDR Analysis
    Micron 1x DDR Analysis

    TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

    Latest Reports
  • Samsung S5K2X7SP 0.9 µm Image Sensor
    Samsung S5K2X7SP 0.9 µm Image Sensor

    Learn more about what reports we have available and planned for this part.

    Latest Reports
    Samsung 64L 3D V-NAND

    Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

    Latest Reports
    Toshiba 64L NAND – BiCS FLASH

    Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.

    Latest Reports
IPBC Europe
IPBC Europe

Paris, France: Designed by and for European IP owners, the programme for IPBC Europe 2019 will explore how IP managers inside the continent’s businesses can devise and build sustainable value creation programmes in the rapidly changing world.

Latest Events
IPBC Shenzhen
IPBC Shenzhen

Shenzhen, China: As China’s powerhouse for industrial, R&D and commercial activity, the sheer concentration of leading IP-owning companies makes IPBC Shenzhen an unmissable opportunity for learning, networking and deal making.

Latest Events
Auto IP USA 2019
Auto IP USA 2019

Detroit, USA: Building on three years of success in Detroit, IAM’s Auto IP USA will bring together the leading IP experts from across the automotive landscape.

Latest Events
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SK hynix 72L 3D NAND Analysis
SK hynix 72L 3D NAND Analysis

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

Latest Reports
Micron 1x DDR Analysis
Micron 1x DDR Analysis

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

Latest Reports
Intel/Micron 64L 3D NAND Analysis

The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

Latest Reports
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Intel 10 nm Logic Process Analysis
Intel 10 nm Logic Process Analysis

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

Latest Reports
Samsung’s Anti-Fuse Technology found on 18 nm DRAM: Kilopass 2T-cell Technology used
Samsung’s Anti-Fuse Technology found on 18 nm DRAM: Kilopass 2T-cell Technology used

TechInsights is happy to report that we have found and analyzed Anti-fuse array blocks on a Samsung 18 nm DDR4 DRAM die.

Technology Blog
10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
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Technology Blog
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Samsung Galaxy S9 Camera Teardown
Samsung Galaxy S9 Camera Teardown

We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

Technology Blog
Image Sensor Technology: Noteworthy Developments in 2017

We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.

Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
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Technology Blog
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SK hynix 72L 3D NAND Analysis
SK hynix 72L 3D NAND Analysis

SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

Latest Reports
Micron 1x DDR Analysis
Micron 1x DDR Analysis

TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.

Latest Reports
Samsung 64L 3D V-NAND

Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

Latest Reports
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Intel 10 nm Logic Process Analysis
Intel 10 nm Logic Process Analysis

TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.

Latest Reports
Samsung 18 nm DRAM Analysis

TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

Latest Reports
TSMC 10 nm Process

TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

Latest Reports
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Samsung Galaxy S9 Camera Teardown
Samsung Galaxy S9 Camera Teardown

We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.

Technology Blog
Samsung S5K2X7SP 0.9 µm Image Sensor
Samsung S5K2X7SP 0.9 µm Image Sensor

Learn more about what reports we have available and planned for this part.

Latest Reports
Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor

Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS "Motion Eye" camera offering with 960 fps video and predictive capture.

Latest Reports
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Qualcomm Latest RF360 Chipset

The Qualcomm RF360 Chipset includes the WTR5975 Gigabit LTE Transceiver, QET4100 Envelope Tracker and the Snapdragon X16 LTE MDM9250 Modem.

Latest Reports
Apple W1 343S00131 Bluetooth Module

The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.

Latest Reports
Intel PMB5750 LTE Tranceiver Circuit Analysis

This report is a circuit analysis of the Intel PMB5750 LTE Tranceiver. Apple’s use of the Intel modem chipset is a huge event in the industry as Intel modems will represent a minority of iPhone shipments (est. 22 M units in 2016 and 23 M units in 2017).

Latest Reports