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Our Latest Analysis

Quick Survey Teardown of the Samsung Galaxy S21+ 5G SM-996U Smartphone

Samsung

5G Handset

Survey Plus Teardown of the Samsung Galaxy S21+ 5G SM-996U Smartphone

Samsung

5G Handset

Qualcomm Snapdragon 888 Samsung 5LPP Process aCMOS Essentials

Xiaomi Tech

Multi-band Handset

Bill of Materials of the Microsoft Xbox Series S 1883 Video Game Console

Microsoft

Game Console

Deep Dive Teardown of the Microsoft Xbox Series S 1883 Video Game Console

Microsoft

Game Console

Bill of Materials of the Livox AVIA LiDAR Sensor

Livox

LIDAR

Recent News and Blogs

Webinar: The Power Revolution - Innovation and IP in Power Management Technologies

Webinar The Power Revolution: Innovation and IP in Power Management Technologies Innovations relating to power and power consumption are an increasingly hot topics as society works to reduce our power footprint by reducing power consumption and

11May

Apple iPad Pro Teardown

Teardown Technology Apple introduced the new iPad Pro (2021) on April 20th, will it be the most powerful and advanced iPad Pro ever? The Apple-designed M1 chip is the foundation and main contributor to the performance increase. TechInsights has

06May

Apple Homepod Mini Teardown

May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four

05May

Intel's 2nd Generation XPoint Memory

April 30, 2021 Dr. Jeongdong Choe Intel's 2nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1st gen. XPoint Memory (OptaneTM Memory 16GB, MEMPEK1W016GA) including structure

30Apr

Qualcomm extends their mmWave leadership position

April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of

21Apr

Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) - Memory Blog

April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in

16Apr

World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin

March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1

31Mar

TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis

March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it into a dozen application areas

23Mar

KIOXIA’s new XL-FLASH for ultra-low latency NAND application

March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high

23Mar

Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog

March 16, 2021 Ziad Shukri Dynamic Vision Sensors – A Brief Overview Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture. With DVS, individual

18Mar

Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies

March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive

16Mar

A New and advanced ReRAM from Fujitsu

March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The

11Mar

GaN USB-C Charger Market Heating Up in 2021

March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights

10Mar

Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary

March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on

03Mar

Webinar: Selected Imager and Sensor Trends and Comparisons

March 3, 2021 Image Sensor Technology Webinar: Selected Imager and Sensor Trends and Comparisons Now on-demand! The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual

03Mar

LiDAR 101 – Solid-State and Mechanical LiDARs

February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster

19Feb

Webinar: Gearing Up for the Electric Vehicle (EV) Revolution

Presented by: Stephen Russell & TechInsights Power Subscription Gearing Up for the Electronic Vehicle (EV) Revolution State of the Art Power Devices The global drive towards green energy is accelerating. Ten years ago, electric vehicles (EVs) were a

03Feb

Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market

February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings

03Feb

Supporting IP strategy in the semiconductor industry

Supporting IP strategy in the semiconductor industry Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse

27Jan

Sony d-ToF Sensor found in Apple’s new LiDAR camera

January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry

19Jan

Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain

Increasing Value of Semiconductor IP in the Automotive Supply Chain Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge

17Dec

Teardown: Velodyne Lidar Puck VLP-16 sensor (Electronics360)

A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.

14Dec

Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters

Emerging GaN Technology in USB-C Power Delivery Adapters This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection

09Dec

3D flash memory, 176 layers!

So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.

09Dec

Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends

Memory Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and

02Dec

Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12

An Examination of the Technical and Financial Implications of the Apple iPhone 12 This webinar was presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most

10Nov

Micro Loading And Its Impact On Device Performance

How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.

02Nov

Webinar: ALD/ALE Process in Commercially Available Memory Devices

ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will

28Oct

iPhone Camera History: iPhone 12's Alternative and Normal

The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last

21Oct

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G chip design and manufacturing

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing

Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying

23Sep

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral

14Sep

Webinar: ALD/ALE Process in Commercially Available Logic Devices

ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards

26Aug

60 years of the Semiconductor industry and its changing patent strategy

Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device

04Aug

Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony

STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.

26Sep

Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication

Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and

07Feb

Creating Better Applications Through Patent Strengthening

Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

20Jun

What does Uber’s patent landscape look like?

Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years

27Feb

COVID-19

We have been closely monitoring the progress of COVID-19 in recent weeks, regularly updating our travel and operations policies to include increasingly strict restrictions we have chosen to implement. Our priority is ensuring the continued health and

04Mar