Authoritative Semiconductor & Microelectronics Intelligence Platform
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.
TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.
Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Linley Fall Processor Conference 2022
TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights - a Hybrid Event, will be held in Santa Clara, California on November 1-2, 2022. If you cannot attend in person, tune in to our virtual livestream or watch the presentations OnDemand at your convenience.
The Medtronic PillCam SB3: packaging a capsule endoscope
The Medtronic PillCam SB3: packaging a capsule endoscope John Scott-Thomas Endoscopy is a medical procedure that examines the interior of a body using a camera. Common for digestive track imaging, a conventional endoscope uses a tube that is inserted
Review and Things to Know: Flash Memory Summit 2022
The Flash Memory Summit 2022 conference including an Expo was held at Santa Clara Convention Center (US) last week (Aug. 1 – 4). Many of the industry-leading memory manufacturers and module suppliers exhibited their latest products in flash storage technology. TechInsights is a recurring and popular speaker at FMS.
First commercially available Wi-Fi 7 (802.11 be) wireless router: H3C Magic BE18000
First commercially available Wi-Fi 7 (802.11 be) wireless router: H3C Magic BE18000 Radu Trandafir Less than 2 months after the announcement of Qualcomm’s Wi-Fi 7 (IEEE 802.11 be) networking chipset, known since 2019 as Networking Pro Platform, we
SMIC’s Next Generation Process
TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.
MPR Editorial: Nanometer Nonsense
Both leading foundries allowed customers to claim they were using a 4nm process when, in fact, they were using 5nm technology. This situation renders node names meaningless. Featured in our July 22 Microprocessor Report we are making this available, in full, for a limited time.Latest Report Analysis
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a digital floorplan analysis (DFR) of the GoPro GP2 processor, fabricated using TSMC's 12FFC FinFET process.
This report presents a Standard Floorplan Analysis of the ISP die from the OmniVision OX08B4C, an 8.3 MP, 2.1 μm pixel pitch, stacked back-illuminated CMOS Image Sensor from the Sensing World SG8-OX08BC-5300-GMSL2 automotive camera.
This report presents a device essentials folder (DEF) of the SmartSens SC501CS 1/5" 5.0 MP resolution 1.12 µm pixel pitch CMOS image sensor, fabricated using SmartClarity-2 and SFCPixel technology, and extracted from the Samsung Galaxy A03s smartphone front-facing camera.
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."