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Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
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TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Webinar: mmWave Antenna Module Implementation Considerations for 5G Smartphones
TechInsights’ Radu Trandafir takes a closer look at the three mmWave antenna modules used by Apple in the iPhone 12/13 which mark an interesting departure from the “traditional” Qualcomm-based architecture at the implementation level.
10 BEST Semiconductor Equipment Supplier Rankings for 2022
Advantest, ASML, FormFactor, Plasma-Therm, and EV Group earn 5 Star Ratings in the 2022 10 BEST Suppliers
THE BEST Semiconductor Equipment Suppliers of 2022
Take a look into what THE BEST suppliers of 2022 are best at, and their ratings.
Samsung SmartTag+ & Apple AirTag: An Ultra-Wide-Band Device Comparison
Like Bluetooth, the UWB is a short-range, low-power, radio-based communication technology whose primary purpose is for location discovery and device ranging. However, UWB offers a multitude of different functions, such as fast and reliable file-sharing features and secure transactions.
The EPC 2152 – A Fully Integrated GaN Half-Bridge IC
TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.
Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead
Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.Latest Report Analysis
This report presents a Device Essentials (DEF) summary of the SmartSensSC410GS, 1/1.3”, 4.0 MP, 4.2 μm Pixel Pitch Back-Illuminated Voltage Domain Global Shutter CMOS Image Sensor for Automotive and Intelligent Traffic System.
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
This report presents a digital floorplan analysis (DFR) of the Samsung E9925 Exynos 2200 application processor extracted from the Samsung S22 Ultra smartphone.
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."