Authoritative Semiconductor & Microelectronics Intelligence Platform
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.
TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.
Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Webinar: Fan-Out Packaging Technologies - The Past and Future
TSMC, Apple, and Samsung have all leveraged different Fan-Out Packaging. Join us to get an update on the latest progress of Wafer Level and Panel Level Fan-Out Packaging.
PMICs with Integrated Passive Components
Power Blog PMICs with Integrated Passive Components Contributed by: Stephen Russell Since the launch of TechInsights’ power management integrated circuit (PMIC) Process Analysis channel at the end of 2021, we have analyzed a wide variety of devices
A Trip Down TSMC Memory Lane – Part 1
Logic Blog A Trip Down TSMC Memory Lane – Part 1 Dick James A few months ago we published a blog on MOS process history, triggered by Pat Gelsinger’s keynote at the Intel Innovation Days in November last year, and while at the start it was generic
Webinar: Hybrid bonding technology - today and tomorrow
TechInsights experts review applications of hybrid bonding technology, and discuss what’s to come. This presentation compiles content from TechInsights’ subject matter experts in Memory, Image Sensor, and Logic, and from Engineers specializing in a variety of reverse engineering techniques.
YMTC’s Xtacking 3.0 – Not what TechInsights was expecting to see
Memory Blog YMTC’s Xtacking 3.0 – Not what TechInsights was expecting to see Contributing author: Chi Lim Tan Yangtze Memory Technology Company (YMTC) has been making headlines since it was founded in 2016. Considered China’s leading Integrated
Apple iPhone 14: Teardown and Analysis Webinar
This is the must attend webinar event of the year: Our exclusive Apple Keynote presented in partnership with Bloomberg Intelligence. The panel will include Bloomberg Senior Hardware Analyst Woo Jin Ho, Strategy Analytics’ Associate Director at the Global Wireless Practice Boris Metodiev and Techinsights’ Forecasting Analyst Taylor St. Germain.Latest Report Analysis
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
The samples for this report were removed from the Apple iPhone 14 Pro 5G smartphone.
This report presents a power floorplan analysis (PFR) of the Southchip SC3056QDGR 650 V 368 mΩ GaN enhancement-mode power transistor, extracted from the Anker 511 30 W USB-C wall charger.
This report presents a basic floorplan analysis (BFR) of the Broadcom BCM6756KFEBG Wi-Fi 6/6E quad-core ARM SoC, extracted from the China Mobile TY-6261M internet router.
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
This report presents a Memory Floorplan Analysis of the embedded flash (eFlash) on the NXP Semiconductors SN200 die found inside the NXP 200VB111 component. The 200VB111 packagewas extracted from the Apple A211 iPhone 11 smartphone downstream product.