Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
Key Cloud and Digital Services Revenue to Exceed $5 Trillion in 2031
AI-driven demand is pushing cloud and digital services beyond previous growth expectations. TechInsights forecasts the worldwide market will exceed $5 trillion in annual revenue by 2031, led by continued growth across cloud computing, SaaS, social media, and search.
The Chip Insider®– State of the Semiconductor Union
Inside G. Dan Hutcheson’s latest analysis, the seven layers of the Semiconductor Demand Stack reveal an industry at remarkable highs, as AI demand, semiconductor growth, economic conditions, and geopolitical risks shape the outlook for the cycle ahead.
The Hidden Complexity of the Power GaN Manufacturing Ecosystem Revealed by Technical Analyses
Whose GaN is it anyway? TechInsights brings together technical analyses to examine the die-supplier relationships behind devices from leading power GaN manufacturers.
The Chip Insider®– Strategic implications of ASML’s 12-inch EUV reticle and the TSMC-Intel War
Inside G. Dan Hutcheson’s latest analysis: Intel is moving early on High-NA EUV while TSMC holds back, the next technology cycle raises a familiar question: How much could lithography influence the competitive race?
How Software-Defined Vehicles Are Reshaping the Automotive Value Chain
The automotive software market is reshaping the value chain. See what changing architectures and demand mean for semiconductor suppliers through 2033.
What Teardown Data Actually Confirms About New Technology Adoption
Learn how teardown data from 15,000+ devices confirms which sensor and display technologies are moving from roadmaps into shipping products.
The Chip Insider®– Memories: How Korea and SK hynix rose to dominance in HBM
Inside G. Dan Hutcheson’s latest analysis, the rise of HBM reveals how SK hynix and Korea transformed memory from a commodity business into a strategic AI enabler, reshaping competition and industry economics.
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor
TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
iPhone 18 Pro Max Unboxing and First Look
Watch TechInsights unbox the Apple iPhone 18 Pro Max before our experts begin detailed teardown and semiconductor analysis.
Apple iPhone 18 Pro Max Teardown: A20 Pro, X80 and Apple N1
See what TechInsights’ preliminary teardown reveals about the iPhone 18 Pro Max, including its A20 Pro processor, Qualcomm X80 modem, Apple N1, and new mmWave hardware.
The AI Power Paradox: Why Datacenter Emissions Are Outpacing Grid Decarbonization
Datacenter emissions are rising as AI capacity expands. See why electricity demand could outpace grid decarbonization through 2031.
The Chip Insider®–Huawei’s Tau Scaling and LogicFolding and AI-pocalypse and the token economy
Inside G. Dan Hutcheson’s latest analysis, Huawei’s Tau Scaling and LogicFolding show how performance gains can extend beyond traditional shrinking, while a look at the AI token economy separates lasting impact from AI hype.
Memory Webinar Series: DRAM, NAND, HBM & Emerging Memory
Explore memory technology roadmaps, market trends, and materials innovation across three expert-led webinars, exclusively on the TechInsights Platform.
Apple iPhone 18 Memory Costs: DRAM & NAND Price Pressure
DRAM and NAND prices are rising through the iPhone 18 launch. See what higher memory costs could mean for Apple, AI, BOM costs, and smartphone strategy.
Apple iPhone 18 Pro: A20 Pro, Camera, C2 Modem & Key Changes
Explore what is new in the Apple iPhone 18 Pro and Pro Max, including the 2 nm A20 Pro, variable-aperture camera, C2 modem, cooling, and battery.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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