Detailed analysis profiling cutting-edge packaging innovations seen in real-world products from industry leaders.
Combines technology, reverse engineering, analytics, related news, and our packing industry roadmap to provide the analysis you need to navigate the semiconductor packaging market.
Whether you are a product manufacturer, OSAT, IDM, foundry, or fabless semiconductor company, packing technologies impact your technical decisions and designs.
The Semiconductor Packaging Advantage
Integrated circuits are at the heart of modern technology and are continually evolving, becoming smaller, faster, and more energy-efficient, while expected to operate reliably in a range of conditions on Earth and in space. Packaging technologies are critical as they protect the IC from impact, heat, light, contamination, and even radiation but are also instrumental in enabling size reduction, managing heat, and improving performance. Packaging technologies continue to evolve to improve one or more of the following areas.
- Performance improvements through better die-to-die or chip-to-chip interconnect
- Size/volume reduction enabled by higher levels of integration
- Reliability improvements including:
- Protection from contamination, heat, and radiation
- Mechanical stability through cycling conditions
- Fewer defects/greater yield
- Manufacturing/integration cost reduction
Packaging Technology Innovation
The benefits seen in advanced packaging are typically driven by technical innovation in one of the following areas:
Semiconductor Packaging Subscription
The TechInsights Semiconductor Packaging subscription provides access to upcoming and back-catalog reports that analyze packaging innovation found in leading real-world products in the areas of advanced logic, memory, RF, power, and image sensors. The reports are combined with images, data analytics, expert commentary, industry news, and technology briefings in the TechInsights Platform, creating a comprehensive landscape of the packaging domain.
The Semiconductor Packaging Subscription delivers insights across the following four key technology segments:
Advanced Packaging Analytics
The Logic and Memory Packaging segments also include advanced Logic and Memory Packaging analytics which delivers charting capabilities to visualize the evolution of Logic and Memory packing technologies deployed over time from leading component manufacturers. Users can select the metrics of interest, customize chart settings, and immediately see the results.
This foundational dataset spans multiple chip generations and enables users to deliver real-time visualizations of developing trends and correlations to help you answer critical questions such as how does the I/O density of packaging technology scale as interconnect counts increase? (Correlation between I/O density and interconnect count)
Learn more about the valuable insights revealed by the analytics in the TechInsights Platform.
Related Market Analysis on Semiconductor Packaging
In addition to detailed technical analysis, TechInsights also provides a range of market analyses covering key technology areas. The following is a list of related market analyses targeting Semiconductor Packaging and are available from the TechInsights Chip Market Research Service (CMRS) and Semiconductor Manufacturing Economics.
- Advanced Packaging Equipment History and Forecast 2017-2028
- Quarterly and Yearly Assembly and Packaging Equipment Forecast
- Worldwide Regional Assembly Equipment Consumption
- Assembly and Packaging Market Share
- Assembly and Test Cost and Price Model
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