Packaging+ Carbon Module

A Cradle-to-Gate Tool for Assessing Carbon Impact

Data and calculations available include:

• Standardized and repeatable semiconductor carbon emissions reporting for integrated circuits, including packaging
• Single click cradle-to-gate reporting for more than 29,000 IC products analyzed and inventoried by TechInsights – across consumer, enterprise, and automotive applications
• Detailed die data, including emissions and individual die information (description, number, manufacturer, node category, function and size) for multi-chip products
• Comprehensive views of Scope 2 and Scope 3 emissions generated from chip packaging, including 3D IC integration and system-on-a-chip (SoC)
• Data on more than seventy Scope 3 materials used in packaging
• Transportation carbon calculated automatically based on weight of materials used to manufacture and package the die(s), and shipping packaging
• Over 780 assembly processes covered, with 124+ pre-configured package types that can accommodate 11 unique die

Packaging+ Carbon Module Opens Door to Innovative Designs

In this Module, users can run scenarios selecting from more than 29,000 IC products – across consumer, enterprise, and automotive applications - from TechInsights’ extensive databases of teardowns and reverse engineering analysis to easily provide credible data to support reporting, benchmarking, and competitive analysis. This Module currently includes 124 package types with more being added monthly. The dataset is inclusive of data from 2015 through to present. The scenarios created can be saved and used for comparison against similar or adjacent IC products.

Multichip Memory IC Product

The Packaging+ Carbon Module is part of TechInsights’ EcoInsights portfolio of Sustainability tools and insights. This Module seamlessly integrates with the Manufacturing Carbon Module and the BOM Database with Carbon Footprint, providing standardized and repeatable emissions reporting for integrated circuit products from raw materials to manufacturing to the assembly and test, and finally the transportation to deliver the parts to their destination.

Answering the Unknowns of the Carbon Impact of Chip Packaging

Whether you’re an IC designer, an integrated device manufacturer (IDM), a foundry, or a product manufacturer, the data provided by the Packaging+ Carbon Module can give you an edge in semiconductor carbon reporting. Key features include:

• Easy competitive analysis and benchmarking of carbon emissions at the IC product level
• Access to the carbon contribution of die vs. packaging vs. transportation
• Comprehensive view of Scope 2 assembly and test emissions
• Comparison of carbon emissions of the manufacturing location on an IC product's carbon footprint
• Data on more than 70 Scope 3 materials used in packaging

Multichip Memory IC Product

Looking at a multichip memory IC product, the majority of the CO2e comes from the manufacture of the die. Carbon by source varies significantly based on the number of die in the product, die size, number of die, die manufacturing tools and process, and package type. Source: TechInsights’ Packaging+ Carbon Module, 2024.

The Module provides IC product specific calculations of:

• Scope 1, Scope 2, and Scope 3 die emissions (manufacturing);
• Scope 2 and Scope 3 assembly emissions;
• Scope 2 test emissions;
• Scope 3 transportation emissions;
• Plus: assembly water consumption.

Get answers to key questions about semiconductor carbon impacts and how the industry is working to decrease emissions.

Supporting Your Business in Its Sustainability Reporting

The TechInsights Packaging+ Carbon Module is an essential sustainability tool providing the detailed modeling and benchmarking that supports many areas of the semiconductor value chain, including:

• Fabless Vendors: "One button Cradle-to-gate" reporting for 29,000+ IC products from TechInsights’ teardown analysis
• Integrated Device Manufacturers (IDMs): Detailed IC product carbon emissions and electricity consumption from 2015 to present
• Product Manufacturers: Comprehensive view of IC product emissions by source (die, packaging, and transportation) and Scope 1, 2, and 3

With cradle-to-gate reporting for more than 29,000 IC products, the TechInsights Packaging+ Carbon Module provides detailed calculations, modeling, and benchmarking that supports many areas of the semiconductor value chain, including capital equipment and materials suppliers, IC designers and manufacturers, and electronics companies.

Don’t fall behind the competition on your Sustainability progress. Get more information on TechInsights’ evidence-based sustainability tools and products and see how they can help you gain valuable insights into semiconductor carbon emissions and water use.

Get a free demo and learn more now by speaking with our Sustainability product team.

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The EcoInsights Suite

The Packaging+ Carbon Module is just one element of EcoInsights, an industry-leading product suite empowering companies that work across the semiconductor industry to achieve significant environmental progress. Learn more about how these powerful modules work together to give you the data and tools needed to make informed decisions for a greener future.