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Published: 28 July 2017


This report presents a Basic Functional Analysis of the NXP security microcontroller (MCU) die found inside the NXP 80T17 near field communication (NFC) controller package. The 80T17 components were extracted from the Samsung Galaxy S8 (SM-G950W) and Samsung Galaxy S8+ (SM-G955W) smartphones.

This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

Report Description

This report presents a Basic Functional Analysis of the NXP security microcontroller (MCU) die found inside the NXP 80T17 near field communication (NFC) controller package. The 80T17 components were extracted from the Samsung Galaxy S8 (SM-G950W) and Samsung Galaxy S8+ (SM-G955W) smartphones.

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