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Published: 23 April 2018


This report presents an Exploratory Analysis on the DRAM die found in the rear camera module extracted from a Sony Xperia XZs (model G8232) smartphone. The Sony IMX400 rear camera module is triple-die stacked including the DRAM, a 19 megapixel (MP) back illuminated (BI) CMOS image sensor (CIS), and image signal processor (ISP) dies. The DRAM die is manufactured using stacked DRAM process, with capacitor-over-bit line DRAM cell arrays, tungsten (W) based buried word line (WL), and four interconnect layers consisting of W and three aluminum (Al) layers and connected to ISP and CIS dies using backside Cu redistribution layer and through silicon vias (TSV).

Report Description

This report presents an Exploratory Analysis on the DRAM die found in the rear camera module extracted from a Sony Xperia XZs (model G8232) smartphone.

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