Beken BK3296 22nm Bluetooth Audio SoC Process Flow Analysis

This report provides an analysis of the process flow and integration used in the manufacture of the Beken BK3296 Bluetooth Audio SoC, built using UMC's 22 nm ULP technology. UMC’s 22 nm ULP process derives from the company’s earlier 28 nm planar CMOS technology and offers up to a 10% relative area gain and better power/performance ratio with enhanced RF capability. The spreadsheet lists the hundreds of process flow steps likely used in its manufacture.
22Apr

Analysis: EV, Shared-Mobility Support Critical for Thriving Cities

Upgrading transportation systems in cities like Los Angeles, especially shared mobility at the curb, is critical to their success. For Los Angeles, this undertaking is especially urgent as the city prepares to host three major events: the World Cup in 2026, the Superbowl in 2027, and the Summer Olympic Games in 2028.
22Apr

A Tale of Three Phone Chips: Eco Edition

TechInsights discovered a 20% gap in carbon emissions from manufacturing the semiconductors of three flagship phones, despite smartphones being typically evaluated based on screen size, processor speed, and camera resolution.
21Apr

Global Digital Media Streamer Forecast 2018-2029

The global market for digital media streamers attained maturity in 2021 and declined by 1.5% year-on-year for second consecutive year in 2023, with global shipments at 95.9 million units. The category is in its declining phase and CAGR is anticipated to fall 2.6% between 2024 and 2029.
19Apr

Automotive Semiconductor Market

Automotive semiconductors grew to 12% of total semiconductor sales in 2023, up from 10% in 2022. Infineon and NXP continue to lead the automotive semiconductor supplier sales with STMicroelectronics closing in. Infineon gained over a full percentage point of market share compared to 2022, reaching 13.7% of the automotive semiconductor market in this year. NXP fell by almost a percent to a 10.8% share.
19Apr