The Sony LYTIA LYT900 is a rear wide-angle camera module that was extracted from the Oppo Find X7 Ultra (PHY110) smartphone. The camera module measures 27.96 mm × 31.16 mm × 10.68 mm thick. It contains a stacked imager comprising a CIS die and an ISP die. This floorplan analysis (FAR) examines the ISP die.

Global smartphone industry revenues grew by 8% in Q4 2023. Apple, Samsung and Xiaomi were the top three vendors and together accounted for 3/4th of the global revenues. Apple was the leading vendor by revenues in all of the six regions tracked.

We expect mmWave technology to reach 11% penetration of all 5G smartphones in 2023. The majority of sales volumes come from the North American market.

The Huawei Eyewear 2 LFT-G00 are smart glasses that include two speakers in the temples to create a comfortable open-ear audio listening experience without the need for earpieces. It features the WUQI microelectronics WQ7036AX Bluetooth 5.3/Audio SoC with memory.

The Efficient Power Conversion EPC2619 device includes a single gallium nitride (GaN) power high electron mobility transistor (HEMTs) die with a continuous rating voltage of 100 V, the power GaN transistors operate in enhancement mode (normally-off) and exhibit a typical 3.3 mΩ on-resistance (RDS(ON)) at 5 V VGS bias.

The Apple TMQW67 die, examined in this digital floorplan analysis (DFR), was found inside the Apple S9 module. The Apple S9 system-in-package (SiP) module was extracted from the Apple Watch Series 9 GPS+Cellular (A2984).

A Synopsys 3D-emulation analysis of the process flow and integration used in the manufacture of the Micron Technology MT62F1G64D4AM-031_XT_C (Y52P die), built in Micron’s D1b nm technology. The emulation includes SPX input files that can be used as input into other Synopsys models.

The STMicroelectronics Ouster L3 Chip with 10 µm pixel pitch is the third-generation LIDAR chip. It is a stacked back-illuminated direct Time-of-Flight (d-ToF) SPAD sensor, which competes directly with the SONY IMX459. The L3 SPAD chip has many innovations, including hybrid bonding, in die quench resistor, dual DTI pixel isolation, finger capacitor, and diffraction grating.

The OmniVision OV50K CMOS image sensor (CIS) was extracted from the Honor Magic 6 Pro smartphone (BVL-AN16). The OmniVision OV50K is a Quad Bayer color, 50 MP, stacked back-illuminated (BI) electronic rolling shutter CIS utilizing the PureCel Plus-S technology for mobile cameras. This device essentials (DEF) report examines both the CIS and image signal processor (ISP) die.

This quarterly report provides a comprehensive analysis of the where DRAM and NAND are consumed. This unique perspective considers where the electronics devices that use memory (for example smartphones, servers, and PCs) are ultimately used.