The Main Cover is a Co-Molded Reinforced Plastic Frame. It consists of a Glass-Filled Plastic Inner Frame and Soft Plastic Outer Frame. Waterproof elements available in the construction of devices for: Sealed Buttons Port with rubber membrane, Sealing Tape around the Main Enclosures, Silicone Gasket on Sim Tray Cover, and Sealing Tape around Cameras Windows and Camera Window's Positioning Handle.

The Ecobee Smart Doorbell Camera is a smart home security system unit equipped with a 175-degree vertical view camera. It can stream a live view to Ecobee Smart Thermostat through low energy communication system of BT 5.0 and 2.4/5 GHz WiFi.

Global 5G smartphone wholesale revenues will surge between 2019 and 2029. 5G is by far the fastest-growing sector of the smartphone industry for the next decade. The majority of mmWave sales volumes will come from the North American market. Sub-6GHz will remain the main 5G technology for the foreseeable future.

The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.

Both smartphones also have the same battery charging design with the only exception that Xiaomi 14 Pro has Wireless charging capabilities. It is also similar to the Xiaomi Redmi Note 13 Pro’s design with a difference in which main SoC (SC8551A) was used.

The Fitbit Charge 6 G3MP5 is the latest activity tracker from Fitbit Inc. and an improved successor to the Fitbit Charge 5 FB421. The Charge 6 has a 1.04” OLED Display. In both devices, the Display/Touchscreen Subsystem is made by Truly Opto-electronics and has the same part number. The Display Panel and touchscreen Module are separated in this subsystem.

Embark on a journey with TechInsights as we explore the world of Tesla's advanced Full Self-Driving (FSD) driving capabilities.

This briefing features key innovations in the latest new technologies: TSMC 3 nm and Intel 4 nm, and the disruptive SMIC 7 nm N+2, through the lens of digital gates and standard cell libraries. Discover our latest benchmarking on scaling and transistor density metrics of leading flagship SoCs like the Apple A17, HiSilicon Kirin 9010, and MediaTek Dimensity 9200.

The Samsung 1 Tb 236L triple-level-cell (TLC) 3D NAND flash memory device (die markings: K9AKGD8J0B) is one of 16 dies packaged inside one Samsung K9DYGY8J5B-CCK0 NAND flash memory package, which was found in the MZ-V9P4T0 990 Pro PCIe 4.0 NVMe M.2 4 TB solid state drive (SSD).

HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra Discover the groundbreaking technology behind Huawei's Pura 70 Ultra smartphone, powered by the innovative HiSilicon Kirin 9010 processor. Delve into our in-depth analysis by the TechInsights team, uncovering the intricacies of the processor and