Product Code
ACE-1706-801
Availability
Published
Product Item Code
UNK-G8232_Rear-Cam
Device Manufacturer
Unknown
Device Type
Camera Module
Subscription
Packaging
Channel
Advanced Packaging - Process
Sony IMX400 3-Stack Image Sensor ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for PCM chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
- Downstream product teardown
- Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
- SEM bevel through the logic region and PCM
- SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
- One (or two) TEM cross sections, orthogonal to the word (and bit) lines showing the PCM array cells, lower metals and dielectrics, transistor gates, isolation, and other FEOL features
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