Product Item Code
Power Management IC
Advanced Packaging - Process
Qualcomm PM8150 Advanced Packaging Essentials
This is an Advanced Packaging Essentials (APE) summary document for the PM8150 fan-in wafer level package (FI-WLP) built using Deca's packaging technology, The complete APE deliverable includes: concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:
- Downstream product teardown
- Package photographs and X-rays
- Die photographs
- Optical planar view images of the redistribution layers (RDLs)
- SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias
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