PM8150 fan-in wafer level package (FI-WLP) built using Deca Technology's packaging technology
Product Code
Release Date
Product Item Code
Device Manufacturer
Device Type
Power Management IC
Advanced Packaging
Advanced Packaging - Process
Qualcomm PM8150 Advanced Packaging Essentials
This is an Advanced Packaging Essentials (APE) summary document for the PM8150 fan-in wafer level package (FI-WLP) built using Deca's packaging technology, The complete APE deliverable includes: concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:
  • Downstream product teardown
  • Package photographs and X-rays
  • Die photographs
  • Optical planar view images of the redistribution layers (RDLs)
  • SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias

Make informed business decisions faster and with greater confidence

Start My Free Trial


The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.