Product Item Code
Advanced Packaging - Process
Samsung 9820 Application Processor PoP with Interposer Technology Advanced Packaging Essentials
This is an Advanced Packaging Essentials (APE) summary document for the Samsung 9820 application processor package-on-package (PoP) with interposer technology. The complete APE deliverable includes: concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:
- Downstream product teardown
- Package photographs and X-rays
- Die photographs
- Optical plan-view images of selected printed wiring board (PWB) metal layers
- SEM and optical cross section of the general package structure, metals, dielectric materials, and the die and package interconnect structure
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