Product Code
Release Date
Product Item Code
Device Manufacturer
GAN Systems
Advanced Packaging
Advanced Packaging - Process
GaN GS66508B/GS66508T Embedded Die Package Advanced Packaging Essentials
This is an Advanced Packaging Essentials of the GaN Systems GS66508T and GS66508B 650 V E-mode GaN transistor embedded die package technology. Each of the GS66508T and GS66508B components is an enhancement mode GaN-on-silicon power transistor and uses embedded die package technology. The power transistor die is fully embedded in a two-layer printed wiring board (PWB).
  • Downstream product teardown
  • Package photographs and X-rays
  • Die photographs
  • Optical planar view images of the redistribution layers (RDLs)
  • SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias

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