Product Code
ACE-1803-802
Release Date
31/05/2018
Availability
Published
Product Item Code
UNK-SM-G965F_Dual-Rear-Cam2_Wide
Device Manufacturer
Unknown
Device Type
Camera Module
Subscription
Packaging
Channel
Advanced Packaging - Process
Samsung S5K2L3SX CIS from Galaxy S9+ (Model SM-G965F/DS) ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packing comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package photographs and X-rays
  • Top metal die photographs
  • Optical cross section of general package structure
  • SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
  • SEM cross section of TSV, where applicable
  • Optical and SEM bevel images of the package assembly

Make informed business decisions faster and with greater confidence

Start My Free Trial

Sign up for latest analysis, news and insights from TechInsights!

Stay informed about TechInsights’ products, services, and events. Email collection adheres to TechInsights’ Privacy Policy.

Revealing the innovations others cannot inside advanced technology products
Contact

General Inquiries

1-888-666-8888

1891 Robertson Rd #500, Nepean, ON K2H 5B7