Product Code
Release Date
Product Item Code
Device Manufacturer
Device Type
Camera Module
Advanced Packaging
Advanced Packaging - Process
Samsung S5K2L3SX CIS from Galaxy S9+ (Model SM-G965F/DS) ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packing comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package photographs and X-rays
  • Top metal die photographs
  • Optical cross section of general package structure
  • SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
  • SEM cross section of TSV, where applicable
  • Optical and SEM bevel images of the package assembly

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