Product Item Code
Advanced Packaging - Process
Samsung S5K2L3SX CIS from Galaxy S9+ (Model SM-G965F/DS) ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packing comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
- Downstream product teardown
- Package photographs and X-rays
- Top metal die photographs
- Optical cross section of general package structure
- SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
- SEM cross section of TSV, where applicable
- Optical and SEM bevel images of the package assembly
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