Product Code
ACE-1804-804
Release Date
Availability
Published
Product Item Code
INT-SR3RM
Device Manufacturer
Intel
Device Type
Microprocessor
Subscription
Advanced Packaging
Channel
Advanced Packaging - Process
Intel SR3RM HBM2 EMIB ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Package photographs and X-rays
  • Top metal die photographs
  • Optical cross section of general package structure
  • SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
  • Scanning electron microscopy (SEM) cross section of EMIB structure and die to EMIB interconnect
The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
 

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