Product Item Code
Advanced Packaging - Process
Intel SR3RM HBM2 EMIB ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
- Package photographs and X-rays
- Top metal die photographs
- Optical cross section of general package structure
- SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
- Scanning electron microscopy (SEM) cross section of EMIB structure and die to EMIB interconnect
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