Investments

TechInsights continues to make substantial investments to drive value and quality for all our customers.

TechInsights has invested in cutting-edge solutions that expand our capabilities and enhance our customers’ experience. In today's dynamic business landscape, companies that consistently invest in innovation, infrastructure, and talent are not only ensuring their own success, but also creating a mutually beneficial situation for their customers.

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New Products

TechInsights is proud to introduce an array of new product innovations, each serving to significantly diversify and enrich our company's already extensive expertise and capabilities.

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New Capabilities

We continue to invest in R&D to bring new capabilities which enable us to go deeper, move faster, and connect the dots.

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New Features and Platform Enhancements

A high-level summary of key new features/platform enhancements and their value for prospects and customers.

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TechInsights is proud to introduce an array of new product innovations, each serving to significantly diversify and enrich our company's already extensive expertise and capabilities.

Semiconductor Manufacturing Carbon Model

TechInsights' new Carbon Model empowers chip manufacturers in their sustainability efforts by revealing emission sources and electricity consumption.

TechInsights Platform Enhancements

New features such as annotation, the ability to better share content within the platform, improvements to search, and a more streamlined user experience continue to enable us to enrich the customer experience.

Enterprise Datacenter Teardown

TechInsights has broadened its Teardown analysis to now include equipment in enterprise datacenters.

Component Price Analyzer

This is a powerful tool which enables customers to identify opportunities for cost reduction and to understand lead times and supply constraints.

TechInsights Mobile Application

The TechInsights mobile application has been enhanced to enable customers to better consume content such as blogs, videos, and seminar summaries.

We continue to invest in R&D to bring new capabilities which enable us to go deeper, move faster, and connect the dots.

Delivering iterative versions of content and images, faster

We have developed a new process to issue releases of images, analysis, and insight in Reverse Engineering reports, delivering content to our customers with speed.

Back Catalog

Beyond the new capabilities and products that we are creating, we continue to compile the most comprehensive back catalog of technical analysis, images, and market coverage.

Reverse Engineering preparing for 2nm process nodes

Among the investments that we have recently made are the Talos F200X G2 TEM and a Raith CHIPSCANNER. Our investments in R&D have enabled us to be the trusted source to verify:

  • SMIC’s 7nm (N+1) process in the MinerVa Bitcoin Miner SoC
  • SMIC’s 7nm (N+2) process in the HiSilicon Kiran 9000s processor, which powers the Huawei Mate 60 Pro
  • TSMC’s 3nm process in Apple’s A17 Pro processor, which powers the iPhone 15 Pro and Pro Max
  • Micron’s D1b LPDDR5 16 Gb DRAM chip in the iPhone 15 Pro

Updated State-of-the-art Lab: Microelectronics Reverse Engineering and Market Analysis

Gain access to the leaders in microelectronics reverse engineering and market analysis. From chip identification down to structural analysis at the atomic level, TechInsights uses proprietary sampling and imaging tools in our state-of-the-art lab. This allows our expert team of engineers, scientists and technologists to uncover the insights our customers demand, to help them make informed decisions about their products, design roadmaps, and longer-term technology investment decisions.

Market Analysis

We have expanded our market analysis coverage through acquisition of best-in-class firms such as VLSI, Strategy Analytics, Linley Group, McClean Report, and IC Knowledge. Individually, these companies provided unique and valuable data and insights. Building upon these great businesses we are now launching the most robust end-to-end coverage of the full Semiconductor Value Chain connecting technical verticals such as logic, memory, image sensors, power, and RF with industry verticals such as Datacenter, Mobile, Compute, AI, and Consumer Electronics.

Teardown Analysis Speed and Transparency

We have increased the speed by which our Teardown analysis is delivered up to 4 weeks faster than before and increased visibility to customers by expanding our checkpoints from 2 to 6.

Expanding our team of experts

In addition to our Senior Fellows including Dr. Jeongdong Choe, Dan Hutcheson, Scotten Jones, and Linley Gwennap, we have recruited experts such as Dr. Dan McGrath, Dr. Owen Rogers, Mike Howard, Walt Coon, Carrie MacGillivray, and Brett Azuma. This is in addition to the more than 1000 years of combined experience in our engineering team and hundreds of years in combined analyst experience.

A high-level summary of key new features/platform enhancements and their value for prospects and customers.

Home page enhancement: improved navigation

Improved navigation menus on the home page make it easier to discover and explore different content areas on the Platform.

Home page enhancement: trending data

Surfaces more relevant insights from the breadth and depth of content available in the Platform with trending data visualizations.

Home page enhancement: trending content

Enables easier discovery of popular content on the Platform and provides insight into topics of interest in peer communities.

New online data reports for Consumer Electronics

Provides self-serve visualizations of the latest consumer electronics market data to help inform business decisions.

Improved view of upcoming Image Sensor analysis

Enables users to plan and strategize accordingly with an improved, clearer view into upcoming analyses /parts and more obvious filtering capabilities.

Easily find complimentary blogs and videos

Increases exposure and awareness of the scope of information available in the TechInsights Platform by making it easier to find complimentary content across technical, market, and spend analyses.

Digest notifications can now include more new content

Enables users to be notified of newly published content in areas of interest outside of their subscription, hence increasing awareness of the breadth and depth of information available in the TechInsights Platform.

Ability to hide/show table of contents in the PDF viewer

Ensures a seamless reading experience without obstruction regardless if users are accessing content on desktop, mobile phone, or tablet.

New release of the Semiconductor Manufacturing Carbon Model

Better assess carbon impact of logic and memory technologies with improved usability and enhancements to the model such as automatic scenario calculation and editable fields for die inputs.

Right-click support for Content Navigators

Right-clicking any content within a content navigator in the Platform (e.g. Search, module, vertical, channel level pages, Recent Activity + View All pages in the Home page, and Favorites) will present the context menu with a default set of options that vary per browser.

Platform API User Guide now available for subscribers

Increases organizational productivity by enabling software development users to leverage TechInsights’ analysis metadata (e.g. product titles, descriptions, product codes, completion dates, URLs, etc) in their internal applications (e.g. a larger information portal or content aggregator). It also allows users who previously had access to market analysis data via XML/FTP feeds to continue with this access method.

Spectrax Lite is now live!

Discover mobile devices effortlessly with this powerful tool. Explore by technology, chipset, brand, and more. Watch a demo to understand how to unleash SpecTrax Lite's capabilities.

More featured analysis for the home page

Home page now includes featured technical analysis in addition to market analysis to highlight the breadth of content available in the Platform.

Related content recommendations

Encourages increased user engagement and repeat visits to the Platform by providing tailored content recommendations to users based on reports they have previously viewed.

Related content on the analysis view page

Makes it easier for users to discover related content in the Platform such as other analyses, blogs, and videos, which increase the value/benefit of their subscription. Non-entitled content will be indicated with a lock icon.

“My Subscription” filter for TechStream blogs

Increases flexibility by allowing users the choice of viewing all blogs (including non-entitled blogs they don’t have full access to) or only those included with their subscription.

Sharing function expanded to email and Microsoft Teams

The start of a broader effort to integrate the Platform with existing organizational tools.

Share events (webinars and seminars)

Makes it easier to maximize benefits of a subscription by sharing events with other Platform users in the organization.

Images can now be added to Favorites

Easily keep track of images of interest for future reference.

Image Viewer Length Measurement Tool (v1)

IDMs, Fabless, Foundry, and Capital Equipment users can use this tool to verify specifications, ensure accuracy, and identify potential issues or improvements in the design or manufacturing process.

What’s New & Changelog

  • Highlights improvements and new features to help users get more value from the Platform
  • Demonstrates ongoing development investment in the Platform

Search tabs (e.g. Final Analysis, Analysis in Progress, Analyst Reports, Complimentary, Market Data, etc.) replaced by Content Status and Content Category (Analysis and Reports, Analyst Reports, Market Data)

Improves usability as all search results are presented on a single page for easy access instead of across multiple tabs.

Upcoming Analysis now available for Market Analysis and TechInsights on China

Provides visibility into upcoming market analyses to help with internal planning.

New Special Content Channel for Consumers Electronics Show (CES)

  • Highlights our breadth of coverage that includes key industry events and our experts’ perspective on their technical, market, and costing impact
  • Provides easy access to the latest CES content including subscriber reports, videos and free blogs authored by our SMEs and Analysts.

BOM database now includes die carbon footprint

Helps users understand the environmental impact of integrated circuits (ICs) used in devices.

Semiconductor Packaging Vertical

This vertical consolidates packaging-related content across Reverse Engineering such as Advanced Packaging, RFIC Packaging, Image Sensor Packaging, and Power Packaging Analysis.

Video search enhancements (v1)

Ability to search videos (based on video title and metadata) improves discoverability across the breadth of content in the TechInsights Platform.

Improved view of upcoming Image Sensor analysis

Enables users to plan and strategize accordingly with an improved, clearer view into upcoming analyses /parts and more obvious filtering capabilities.

Easily find complimentary blogs and videos

Increases exposure and awareness of the scope of information available in the TechInsights Platform by making it easier to find complimentary content across technical, market, and spend analyses.

Digest notifications can now include more new content

Enables users to be notified of newly published content in areas of interest outside of their subscription, hence increasing awareness of the breadth and depth of information available in the TechInsights Platform.

 

We make these investments to ensure that you have the most technically advanced, best quality, and most comprehensive data and insights about the full Semiconductor value chain.

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