Investments

TechInsights continues to make substantial investments to drive value and quality for all our customers.

TechInsights has invested in cutting-edge solutions that expand our capabilities and enhance our customers’ experience. In today's dynamic business landscape, companies that consistently invest in innovation, infrastructure, and talent are not only ensuring their own success, but also creating a mutually beneficial situation for their customers.

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New Products

TechInsights is proud to introduce an array of new product innovations, each serving to significantly diversify and enrich our company's already extensive expertise and capabilities.

Semiconductor Manufacturing Carbon Model
Semiconductor Manufacturing Carbon Model

TechInsights' new Carbon Model empowers chip manufacturers in their sustainability efforts by revealing emission sources and electricity consumption.

TechInsights Platform Enhancements
TechInsights Platform Enhancements

New features such as annotation, the ability to better share content within the platform, improvements to search, and a more streamlined user experience continue to enable us to enrich the customer experience.

Enterprise Datacenter Teardown
Enterprise Datacenter Teardown

TechInsights has broaden its Teardown analysis to now include equipment in enterprise datacenters.

Component Price Analyzer
Component Price Analyzer

This is a powerful tool which enables customers to identify opportunities for cost reduction and to understand lead times and supply constraints.

TechInsights Mobile Application
TechInsights Mobile Application

The TechInsights mobile application has been enhanced to enable customers to better consume content such as blogs, videos, and seminar summaries.

Investment

New Capabilities

We continue to invest in R&D to bring new capabilities which enable us to go deeper, move faster, and connect the dots.

Delivering iterative versions of content and images, faster
Delivering iterative versions of content and images, faster

We have developed a new process to issue releases of images, analysis, and insight in Reverse Engineering reports, delivering content to our customers with speed.

Back Catalog
Back Catalog
 

Beyond the new capabilities and products that we are creating, we continue to compile the most comprehensive back catalog of technical analysis, images, and market coverage.

Reverse Engineering preparing for 2nm process nodes
Reverse Engineering preparing for 2nm process nodes

Among the investments that we have recently made are the Talos F200X G2 TEM and a Raith CHIPSCANNER. Our investments in R&D have enabled us to be the trusted source to verify:

  • SMIC’s 7nm (N+1) process in the MinerVa Bitcoin Miner SoC
  • SMIC’s 7nm (N+2) process in the HiSilicon Kiran 9000s processor, which powers the Huawei Mate 60 Pro
  • TSMC’s 3nm process in Apple’s A17 Pro processor, which powers the iPhone 15 Pro and Pro Max
  • Micron’s D1b LPDDR5 16 Gb DRAM chip in the iPhone 15 Pro
Updated State-of-the-art Lab: Microelectronics Reverse Engineering and Market Analysis
Updated State-of-the-art Lab: Microelectronics Reverse Engineering and Market Analysis

Gain access to the leaders in microelectronics reverse engineering and market analysis. From chip identification down to structural analysis at the atomic level, TechInsights uses proprietary sampling and imaging tools in our state-of-the-art lab. This allows our expert team of engineers, scientists and technologists to uncover the insights our customers demand, to help them make informed decisions about their products, design roadmaps, and longer-term technology investment decisions.

Market Analysis
Market Analysis
 

We have expanded our market analysis coverage through acquisition of best-in-class firms such as VLSI, Strategy Analytics, Linley Group, McClean Report, and IC Knowledge. Individually, these companies provided unique and valuable data and insights. Building upon these great businesses we are now launching the most robust end-to-end coverage of the full Semiconductor Value Chain connecting technical verticals such as logic, memory, image sensors, power, and RF with industry verticals such as Datacenter, Mobile, Compute, AI, and Consumer Electronics.

Teardown Analysis Speed and Transparency
Teardown Analysis Speed and Transparency

We have increased the speed by which our Teardown analysis is delivered up to 4 weeks faster than before and increased visibility to customers by expanding our checkpoints from 2 to 6.

Expanding our team of experts
Expanding our team of experts

In addition to our Senior Fellows including Dr. Jeongdong Choe, Dan Hutcheson, Scotten Jones, and Linley Gwennap, we have recruited experts such as Dr. Dan McGrath, Dr. Owen Rogers, Mike Howard, Walt Coon, Carrie MacGillivray, and Brett Azuma. This is in addition to the more than 1000 years of combined experience in our engineering team and hundreds of years in combined analyst experience.

 
 

We make these investments to ensure that you have the most technically advanced, best quality, and most comprehensive data and insights about the full Semiconductor value chain.

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