Semiconductor Manufacturing Carbon Model
A Strategic Tool for Assessing Carbon Impact of Logic and Memory Technologies
The TechInsights Semiconductor Manufacturing Carbon Model is the first of its kind to detail Scope 1 and Scope 2 carbon emissions at a wafer and die level. This is achieved by bringing together the equipment, processes, and manufacturing steps for Logic, DRAM, and NAND into a single tool for leading 300mm wafers produced by 184 total fabs.
The tool allows users to create their own unique analyses of carbon emissions through editable fields like utilization, abatement, and electric carbon intensity. Data at customer fingertips include carbon emissions from electricity and on-site fossil fuel gas combustion, process chemical emissions and abatement, and water consumption.
Did you know that EUV systems consume over 10 times more electricity per system compared to older DUV lithography.
Source: TechInsights’ Semiconductor Manufacturing Carbon Model
Addressing Semiconductor Carbon Emissions: A Two-Part Challenge
As demands for semiconductor technology continue to increase, so do the impacts of the semiconductor industry on the environment. With the climate crisis intensifying, the semiconductor industry faces a two-part problem:
- Design greener processes and technologies to reduce carbon emissions while simultaneously producing more powerful semiconductors
- Reduce carbon emissions from existing manufacturing facilities
Examining Scope 1 and Scope 2 carbon emissions from manufacturing a die, with breakout for Scope 1 emissions. Source: TechInsights’ Semiconductor Manufacturing Carbon Model, 2024.
Semiconductor Manufacturing Carbon Model Subscription Overview
The Semiconductor Carbon Model calculates Scope 1 and 2 carbon emissions from IC die manufacturing and silicon wafers in the 130nm to 10A range, including logic and memory (NAND and DRAM), and known fabs coming online in the next many years. Scope 1 emissions are further broken down by natural gas and individual process gases. The model provides carbon emissions from 2015 to 2035 allowing users to compare historical results to current and future scenarios.
The model makes it possible to review and compare electricity, carbon emissions, and process gases for each piece of equipment used. Equipment categories include: atomic layer deposition (ALD), chemical vapor deposition (CMP), CVD, dry etch, implant, inspection, lithography, metrology, plating, PVD, spin-on, thermal and wet cleans.
Breakdown of Carbon by Equipment Type for emissions from process gas and electricity.
The model enables users to compare fabs based on:
- Carbon emissions from purchased electricity
- On-site emissions from fossil fuel gas combustion
- Process chemical emissions and abatement efforts
- Water consumption by die and wafer
Supporting Your Business in Its Sustainability Reporting
Covering 184 total fabs, the TechInsights Semiconductor Manufacturing Carbon Model is a vital sustainability tool providing the detailed modeling and benchmarking that supports many areas of the semiconductor value chain, including:
- Foundries, Fabless vendors, and IDMs (integrated device manufacturers) can use the tool to support key design decisions and evaluate investment decisions for new equipment and tools.
- Capital Equipment vendors see value in that the model provides a critical business development tool to compare and benchmark tools versus the competition.
- Product Manufacturers use the Carbon Model provides key inputs into cradle-to-grave analysis and reporting.
Don’t fall behind the competition on your Sustainability progress. Get more information on TechInsights evidence-based sustainability tools and products and see how they can help you gain valuable insights into semiconductor carbon emissions.
Learn more now and speak with one of our semiconductor sustainability experts.
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