Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
The Chip Insider®–Huawei’s Tau Scaling and LogicFolding and AI-pocalypse and the token economy
Inside G. Dan Hutcheson’s latest analysis, Huawei’s Tau Scaling and LogicFolding show how performance gains can extend beyond traditional shrinking, while a look at the AI token economy separates lasting impact from AI hype.
Memory Webinar Series: DRAM, NAND, HBM & Emerging Memory
Explore memory technology roadmaps, market trends, and materials innovation across three expert-led webinars, exclusively on the TechInsights Platform.
Apple iPhone 18 Memory Costs: DRAM & NAND Price Pressure
DRAM and NAND prices are rising through the iPhone 18 launch. See what higher memory costs could mean for Apple, AI, BOM costs, and smartphone strategy.
Apple iPhone 18 Pro: A20 Pro, Camera, C2 Modem & Key Changes
Explore what is new in the Apple iPhone 18 Pro and Pro Max, including the 2 nm A20 Pro, variable-aperture camera, C2 modem, cooling, and battery.
Can 2200 V PowiGaN Challenge Silicon Carbide?
Access TechInsights’ special report on Power Integrations’ 2200 V PowiGaN demonstration and its potential impact on high-voltage power semiconductor markets.
iPhone 18 Storage Pricing: Apple's New $1,200 Upgrade
Apple changed iPhone 18 storage pricing with escalating $200, $400 and $600 upgrades. TechInsights examines what it could mean for margins and buyers.
Apple iPhone 18 Rumors: Pro, A20 and Foldable Preview
Explore Apple iPhone 18 Pro and foldable iPhone rumors, including the A20 Pro, 2 nm silicon, C2 modem, cameras, memory, suppliers, and release strategy.
OpenAI Jalapeño: The Architectural Decisions Behind Its Inference Efficiency
OpenAI Jalapeño's benchmark results have attracted attention, and a closer look at the design choices provides important context for understanding the performance. This article presents TechInsights’ commentary on the decisions disclosed at Hot Chips.
What a Die-level Analysis Reveals About Apple's M5 Pro GPU Design
When Apple announced the processor, much of the discussion focused on how the two dies were connected and the role of TSMC's SoIC-X face-to-face (F2F) hybrid bonding technology. The next question is how Apple laid out the GPU die, which we examined in our latest Digital Floorplan Quick Look (DFQ).
The Chip Insider®– Risk of an AI Bubble
Inside G. Dan Hutcheson’s latest analysis, he explains why the AI boom bears all the hallmarks of a bubble, tracing its unprecedented rise from millions to over $100 billion and exploring how lasting value is created long after market speculation fades.
Don’t Let Carbon Compliance Cost You Customers: The New Rules for Semiconductor Supply Chains
Accurate carbon reporting is now required across the semiconductor supply chain. Learn how to build an auditable data strategy to maintain your market position.
HiSilicon Kirin 9030 Pro Process Flow Analysis: How Does SMIC’s N+3 Process Compare to Leading-Edge Nodes?
How does SMIC N+3 compare with other leading-edge nodes? A process flow analysis of the Kirin 9030 Pro provides the measured layer-by-layer evidence.
Intel Core Ultra X7 358H Microprocessor: Evaluating the Foveros-S 2.5D packaging technology
The Intel Core Ultra X7 358H combines three active tiles in a single Foveros-S 2.5D package. TechInsights’ Advanced Packaging Quick Look documents how Intel implemented the package, including its materials, interconnects, and structural design.
Co-Packaged Optics (CPO): Mapping the Market and Supply Chain Ecosystem Behind AI Datacenters
Who is positioned to compete as co-packaged optics (CPO) scale? TechInsights maps the market, supply chain, critical bottlenecks, and vendor landscape.
US Hyperscalers Now Drive 15 of the World’s Top 20 Datacenter Markets
Where are hyperscalers concentrating datacenter capacity? Q1 2026 data shows why 15 of the top 20 markets are in the US and which cloud providers lead.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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