Power and Compound Fab Capacity Projected to Top Record 10 Million Wafers Per Month in 2023, SEMI Reports

Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today in its Power & Compound Fab Report to 2024.
12Oct

Samsung Demos In-Memory Processing

The company disclosed architecture and performance details for the processor-in-memory (PIM) version of its popular Aquabolt HBM2. The HBM-PIM, dubbed Aquabolt-XL, adds compute to a drop-in HBM2 stack.
12Oct