Worldwide silicon wafer shipments increased 3.3% to 3,649 million square inches in the third quarter of 2021 compared to the previous quarter, a new industry record, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced receipt of two orders for ACM’s Ultra C pr wet stripping system from a leading global integrated device manufacturer (IDM).

SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain, and FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, will co-locate at the Moscone Center in San Francisco, July 11-14, 2022.

Semiconductor sales jumped by another 1% W/W while Y/Y growth continued to decelerate.

The number of design completions is expected to increase over 2% in 2021 on the back of a strong semiconductor market.

What's inside the Google Pixel 6 Pro Teardown? Contributing authors: Stacy Wegner, Daniel Yang, Radu Trandafir, Aakash Jani The much anticipated Google Pixel 6 Pro has arrived in our lab for teardown. This one took us some time to find! The phone used for the teardown is a Canadian model GA03161-CA

Intel’s Core i9-12900K chip delivers a double-digit performance advantage over AMD’s fastest Ryzen processor. To do so, it runs at a sweltering 241W while using new superfast DDR5 DRAM.

The new Tensilica HiFi 1 DSP consumes less die area and power than the popular HiFi 3 but adds new instructions that improve performance on Bluetooth 5’s Low Complexity Communication Codec (LC3).