Featured Report Analysis
Disruptive Event - Apple’s H2 BT 5.3 Audio SoC
Apple’s H2 BT 5.3 audio SoC – elevating the audio experience in the AirPods Pro 2
Disruptive Event - Broadcom BCM59365 Wireless Charging PMIC
New Broadcom BCM59365, featuring the most advanced wireless charging PMIC observed to date.
Disruptive Event - YMTC 232L TLC 3D NAND
Download this disruptive event brief to get detailed die images of Xtacking 3.0, further information about our planned analysis, and a comparison table showing YMTC’s three most recent solutions, 128L CDT1B (August 2021), 128L CDT2A (November 2022), and 232L EET1A.
Disruptive Event - MediaTek Dimensity 1050 Chipset
MediaTek’s Dimensity 1050 chipset is making 5G mmWave support in smartphones more affordable. Until now, only top tier US devices were equipped with 5G mmWave capabilities.
Sony IMX662 Image Sensor
Security and surveillance camera equipment is frequently required to perform in challenging lighting conditions. Based on multiple customers demands for performance upgrades to their STARVIS system, Sony have developed the IMX662, the latest from the STARVIS 2 family of image sensors.
Samsung HKMG DDR5 DRAM
Samsung’s HKMG DDR5 is the most advanced DRAM product available. Based on the successes of this device design, HKMG is likely set to become the new standard in DRAM manufacturing. Learn more about this technology innovation here.
Samsung ISOCELL HP1 found in the Motorola Moto X30 Pro
TechInsights has just received the Motorola Moto X30 Pro (XT2241-1) smartphone and launched an analysis on its wide-angle rear camera, confirming the Samsung HP1.
SMIC 7nm is truly 7nm technology, how it compares to TSMC 7nm
Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies. Our analysis also uncovered many similarities between the SMIC 7nm and the TSMC 7nm, which are available in our comparison brief.
SMIC’s Next Generation Process
TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.
MPR Editorial: Nanometer Nonsense
Both leading foundries allowed customers to claim they were using a 4nm process when, in fact, they were using 5nm technology. This situation renders node names meaningless. Featured in our July 22 Microprocessor Report we are making this available, in full, for a limited time.
ROHM Gen 4: A Technical Review
A collaboration between Dr. Stephen Russell (TechInsights) and Prof. Peter Gammon (PGC). ROHM released their 4th generation (Gen 4) MOSFET products this year. The new range includes MOSFETs rated to 750 V (increased from 650V) and 1200 V, with a number of the available TO247 packaged components automotive qualified up to 56A/24mΩ.
Disruptive Technology: 7nm SMIC MinerVa Bitcoin Miner
TechInsights has discovered what appears to be SMIC 7nm technology in the MinerVa Bitcoin Miner SoC. Learn why this matters and its market impact by downloading our Disruptive Technology Brief today.
Disruptive Technology: ROHM Generation 4 SiC MOSFET
New ROHM 4th Generation SiC MOSFETs Featuring the Industry’s Lowest ON Resistance. Download the product brief for more details, and for a high-resolution image showing the trench structure with annotations.
Qualcomm QTM545 Analysis
The Samsung Galaxy S22 Ultra has the latest and greatest Qualcomm mmWave, but not in Europe...
Disruptive Technology: TSMC 22ULL eMRAM
TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm
Micron 176L 3D NAND
NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process
Micron DDR5 DIMM Technology
DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as
Micron 1α DRAM Technology
DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first