Authoritative Semiconductor & Microelectronics Intelligence Platform
世界有数の技術系企業のパートナー
テックインサイツは 30 年以上にわたり、技術解析レポートを発行し、クライアント企業の知的財産戦略の促進を実現してきました。当社のレポートライブラリは、半導体および民生用製品のリバースエンジニアリング解析を格納する世界最大規模のデータベースです。
製品
知財サービスと技術情報という 2 つの統合された部門を通じて、特化型サービスや製品を幅広くご提供しています。
リバースエンジニアリング
詳細な特許および技術解析の基準を定めるリバースエンジニアリング能力と、世界最大規模のアーカイブ技術情報データベースをご提供します。
戦略的パートナー
テックインサイツは 25 年以上にわたり、世界有数の革新的な企業に、特許や技術の戦略的なパートナーとしてサービスをご提供してまいりました。
Latest Posts From Our Blogs
Hybrid Bonding Technology - 2023 and beyond
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
Power of the Chip Series
This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
Lithography: Now and Then
Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
Throwback to 2021 CIS Technology Trends
CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.
iPhone 14 Pro's New Ambient Light Sensor – Inside the Package
Apple’s annual big reveal in September 2022 promised an iPhone 14 with “a re-engineered proximity sensor”, detecting light from behind the display to save additional space. This is the type of announcement the CIS subscription likes to hear about, and indeed our initial teardown analysis showed that Apple decided to change their approach to the proximity sensor.最新の解析
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents an advanced memory essentials (AME) of the Fujitsu MB85R8M2TABGL-G 8 Mb FRAM.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a digital floorplan analysis (DFR) of the Nvidia Jetson AGX Orin AI SoC. The AGX Orin is designed for powerful AI computing in autonomous machines such as advanced robotics and other AI Edge applications. This report provides analysis of the IP blocks and other design features including the cell libraries used in the design of those block.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a battery essentials (BEF) of the Sunwoda A2866 stacked pouch Li-ion battery, extracted from the Apple iPhone 14 Pro.