Authoritative Semiconductor & Microelectronics Intelligence Platform
世界有数の技術系企業のパートナー
テックインサイツは 30 年以上にわたり、技術解析レポートを発行し、クライアント企業の知的財産戦略の促進を実現してきました。当社のレポートライブラリは、半導体および民生用製品のリバースエンジニアリング解析を格納する世界最大規模のデータベースです。
製品
知財サービスと技術情報という 2 つの統合された部門を通じて、特化型サービスや製品を幅広くご提供しています。
リバースエンジニアリング
詳細な特許および技術解析の基準を定めるリバースエンジニアリング能力と、世界最大規模のアーカイブ技術情報データベースをご提供します。
戦略的パートナー
テックインサイツは 25 年以上にわたり、世界有数の革新的な企業に、特許や技術の戦略的なパートナーとしてサービスをご提供してまいりました。
Latest Posts From Our Blogs
Preview of Qualcomm’s 7th generation 4G/5G Envelope Tracker QET7100
Qualcomm announced the QET7100 – the successor to the QET6100, which they dubbed the "world’s first announced 5G 100MHz envelope tracking solution."
eBook: Chevy Bolt Recall - A Battery of Problems
Using our comprehensive analysis of the Chevy Bolt, TechInsights discusses the technological and chemical aspects that led to this widespread vehicle recall.
Motorola edge X30 teardown
Motorola promotes the motorola edge X30 phone as having “the fastest speeds, the highest resolution smartphone camera, the loudest audio, and the boldest display.” So what technology is there to find behind the claims? TechInsights quick teardown answers some of these questions.
New Lab Investments Bringing us to the Future of Reverse Engineering
TechInsights’ unsurpassed technical abilities come from two important areas – our (amazing!) people, and our tools. To reverse engineer cutting edge technology, we require the equipment and the expertise that keep us at – or ahead of – the pace of the latest technology. And that requires continuous investment in our staff and our tools.
TechInsights' Experiences of the 2021 Chip Shortage
Our views on contributing factors, how it has impacted our semiconductor reverse engineering this year, and looking to the future.
Latest Revelations on the Snapdragon 8cx Gen 3
Qualcomm recently officially released the Snapdragon 8cx Gen 3 which is using 5LPE process technology and is therefore likely based on the Snapdragon 888 made with the Samsung 5LPE process. Based on their announcement and previous analyses, we have reached some key findings.最新の解析
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
The Sony IMX490 is a stacked, back-illuminated image sensor targeting automotive applications. The sensor features a split pixel design and offers simultaneous HDR shooting and LED flicker mitigation (LFM).
This report presents an Advanced Memory Essentials of the SanDisk 060946 1T00 NAND flash package found inside the WDS960G2G0C Kioxia/Western Digital Green SN350 NVMe SSD.
The following is a partial CircuitVision Analysis report on the Maxim MAX77705C. This device is a power management integrated circuit.