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Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying complexity challenges. Regarding 5G mmWave transceivers

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral circuits are stacked under the cell, resulting in

Introduction The world of LIDAR sensing is evolving. Rotating turret LiDARs are commonplace for applications such as autonomous driving (see our Automotive LIDAR teardown subscription), but they are being displaced by a new generation of solid-state laser scanning LiDAR technology. Of particular

ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards the end of the year with their 7 nm node devices

Ray Fontaine August 12, 2020 Our teams have sourced the Samsung 640 x 480 indirect time-of-flight (ToF) with global shutter sensor demonstrated at VLSI 2019 [1]. The IC is reported to be a 65 nm back-illuminated generation sensor and our die photograph seems aligned with the die photograph in the

Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device manufacturer (IDM), fabless, and foundry concepts, each of

Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions, depending on the primary energy source used to

Wednesday June 24, 2020 / 2:00 p.m. ET Hosted By: Chi Lim Tan 3D NAND, or vertical NAND, with its higher density and lower cost per bit, has been a driving force in the popularity of solid state drives (SSD) thanks to the innovation and continued investment from both manufacturers and suppliers. 9x

Some say that in the H2 2017 – H1 2018 timeframe Intel’s 10nm node were so half baked, that Intel had to significantly redesign its 10 nm process technology for subsequent products. In any case, one SKU and limited availability speak for themselves.

Quand on dit ce mois-ci, c’est à l’occasion de la Conférence des développeurs qui se tiendra dans la semaine du 22 juin, un événement très important appelé WWDC ou Worldwide Developers Conference qui se tient en Californie, à San José ou à San Francisco selon les années.

Posted: June 05, 2020 Contributed by: Sinjin Dixon-Warren, PhD The power electronics industry is in a period of transition. For many years silicon-based devices have dominated the industry, with conventional Si MOSFET transistors being used for lower power and intermediate frequency, with super