Latest Blogs and Commentary
Global Memory Market Update | Supply and Demand, Pricing & AI-driven growth
Join Mike Howard and Walt Coon for a data-driven analysis of the global memory market, including supply and demand trends, pricing, AI-driven growth, competitive positioning, and what to expect over the next several years.
HiSilicon Kirin 9030 Pro Process Flow Analysis: How Does SMIC’s N+3 Process Compare to Leading-Edge Nodes?
How does SMIC N+3 compare with other leading-edge nodes? A process flow analysis of the Kirin 9030 Pro provides the measured layer-by-layer evidence.
Memory Technology Roadmap Webinar | DRAM, NAND, HBM & Emerging Memory
Join TechInsights for an in-depth webinar on DRAM, NAND, HBM, and emerging memory technologies. Explore AI-driven innovation, scaling challenges, and the future of semiconductor memory with Dr. Jeongdong Choe.
Intel Core Ultra X7 358H Microprocessor: Evaluating the Foveros-S 2.5D packaging technology
The Intel Core Ultra X7 358H combines three active tiles in a single Foveros-S 2.5D package. TechInsights’ Advanced Packaging Quick Look documents how Intel implemented the package, including its materials, interconnects, and structural design.
Co-Packaged Optics (CPO): Mapping the Market and Supply Chain Ecosystem Behind AI Datacenters
Who is positioned to compete as co-packaged optics (CPO) scale? TechInsights maps the market, supply chain, critical bottlenecks, and vendor landscape.
US Hyperscalers Now Drive 15 of the World’s Top 20 Datacenter Markets
Where are hyperscalers concentrating datacenter capacity? Q1 2026 data shows why 15 of the top 20 markets are in the US and which cloud providers lead.
High Bandwidth Memory in NVIDIA HGX B300: Examining the Micron HBM3E Package
Memory packaging has become a primary differentiator in AI accelerator performance. We take a look at Micron's HBM3E packaging architecture for the NVIDIA HGX B300.
The Chip Insider®– Can’t forecast? Here’s why. SMIC's shocker
Inside G. Dan Hutcheson’s latest analysis, rapid changes in AI and the global chip industry are making market forecasts increasingly difficult.
Why the Advanced Packaging Semiconductor Market No Longer Moves as One
Advanced packaging does not move as a single market. See why packaging strategy increasingly depends on workload and application-based market data rather than on a single-processor view.
The Chip Insider®– Why Test is Outpacing WFE
Inside G. Dan Hutcheson’s latest analysis, the AI-driven shift from consumer electronics to advanced computing reveals why semiconductor test is outpacing WFE and reshaping industry economics.
Google Pixel 11 Analysis | Upcoming Teardown
Every Pixel launch resets expectations for the rest of the Android market. Get the full Pixel 10 teardown now and see the BOM, component sourcing, and design choices the Pixel 11 must top.
Product Manufacturer Briefing | August 2026
Explore the August 2026 Product Manufacturer Briefing from TechInsights, featuring analysis of Huawei, Sony, Samsung, TSMC, Intel, cloud gaming, smart rings, and more.
Snapdragon X2 Elite Extreme Advanced Packaging Analysis: Examining Qualcomm’s SiP Approach
Compared with the previous-generation Snapdragon X Elite, Qualcomm has changed how the system-on-chip (SoC) is packaged. TechInsights performed an advanced packaging analysis to understand Qualcomm's latest packaging approach.
How China Is Closing the RF Front-End Acoustic Wave Filter Gap
See how China's RF front-end industry is advancing acoustic wave filter capabilities and what TechInsights' analysis reveals about OnMicro's capabilities.
How Qorvo's 3D RF-SOI Architecture Is Redefining Smartphone RF Front-End Design
TechInsights reverse engineering reveals the 3D RF-SOI architecture behind Qorvo's latest antenna tuner. Explore exclusive process, circuit, and packaging insights on the TechInsights Platform.
Behind the Headlines: AMD Helios, RTX Spark, AI Glasses & EV Tech
Go beyond the headlines with TechInsights analysis of AI infrastructure, smart glasses, silicon carbide, automotive compute, and EV supply chains.
The Chip Insider®– Dr. Strange-AI-Guys, or How I Learned to Stop Worrying and Love AI
Inside G. Dan Hutcheson’s latest analysis, the AI-driven semiconductor boom reveals more than surging chip demand, highlighting how structural industry shifts, hyperscaler growth, and the end of Moore’s Law are reshaping the market far beyond typical cycle concerns
Beyond the Leading Edge: The Overlooked Opportunity in Mature-Node Decarbonization
Leading-edge processes dominate conversations about semiconductor sustainability, but mature-node chip manufacturing will remain responsible for a significant share of fabrication emissions through 2030. See why decarbonizing mature-node production is essential.