Latest Blogs and Commentary
Confidence in Every Carbon Calculation: How Third-Party Assurance Strengthens Trust in Reporting
As sustainability expectations rise across the semiconductor and electronics value chain, confidence in carbon data is no longer optional. Join TechInsights and the Carbon Trust for an exclusive webinar to discuss the value of third-party assurance for creating trust in reported data across the partner value chain.
Insight: Automotive Finally Embraces Micro-LEDs in Headlights
Micro‑LED headlights gain traction as seven models adopt high‑resolution AFS, boosting visibility and safety beyond conventional LED systems.
Summary - Sony Xperia 1 VII (XQ-FS44) Deep Dive Teardown
Sony’s Xperia 1 VII is a high-end mobile device Japan‑market powered by Snapdragon 8 Elite and Xperia Intelligence AI with deep dive revealing its design.
Analysis: Automotive Semiconductor Industry Performance Snapshot – Q4 2025
TechInsights reviews Q4 2025 results for top auto‑semi suppliers, as the Auto Semi Index climbs 5.7% and shows shifting industry momentum.
NVIDIA Vera Rubin: Solving the Memory Bottleneck in Large-Context AI Inference
NVIDIA Vera Rubin tackles the AI inference memory bottleneck with BlueField-4, rack-scale CPU-GPU design, and optimized KV cache for large-context LLMs.
Summary - Form Smart Swim 2 Pro (FSG3) Deep Dive Teardown
Form Smart Swim 2 Pro smart glasses feature Gorilla Glass 3 and a new heart‑rate sensor with deep dive showing their design and build.
Chip Observer: CES 2026, AI Power Plays, and a $48B M&A Surge
CES 2026 semiconductor news: AI PCs, Snapdragon X2 Elite, $48B in M&A, ZAM memory, and a 2026 forecast projecting a $1 trillion chip market.
Semiconductor Analytics – February 18, 2026
Weekly semiconductor sales stay flat but rise YoY, with Analog & Power ICs improving as the platform tracks trends across major chip segments.
Insight: Windows Refresh and Inventory Pull-in Drive Notebook PC Market to Three-Year High
This insight adds takeaways to Q4 2025 notebook share data and points to ODRs for easy, up‑to‑date, customizable data views.
Intel Panther Lake18A (16th Gen) Advanced Packaging Quick Look
Advanced Packaging Quick Look of the Intel Core Ultra X7 358H microprocessor, packaged using Foveros-S 2.5D packaging technology.
Intel’s Panther Lake Reclaims Process Leadership with 18A Node
Intel's Panther Lake showcases a competitive notebook SoC, but challenges lie ahead with crowded markets and reduced consumer demand of new notebook PCs.
Analysis: High-Value Memory Products Drive Revenue Train
Strong demand for advanced logic pushes TSMC's January revenue to 37% YoY (US$12.7 billion).
Microprocessor Report January 2026 Review
January delivers big with Snapdragon X2, Kompanio 540, Apple M1–M5, Neoverse V3, new RISC‑V, STM32V8, Meta glasses, and 61 CES 2026 launches.
Summary - Halliday AI Smart Glasses (GP101) Deep Dive Teardown
Halliday AI glasses use a 3.6 mm optical module, a 3.5‑inch‑equiv display, long battery life, and support prescription lenses.
Summary - Lenovo Legion Go (8APU1) Deep Dive Teardown
Lenovo’s Legion Go is an EMEA handheld console powered by AMD’s Ryzen Z1 Extreme, with Deep Dive detailing its design, build, and teardown insights.
Beyond Cost Estimates: Why Teardown Analysis Is Your Cost Optimization Advantage
Learn how teardown analysis reveals competitor cost-to-feature strategies and gives manufacturers the evidence they need to optimize costs with confidence.
Beyond Cost Estimates: Optimizing Product Costs with Teardown Intelligence
Reducing costs isn’t about cutting corners—it’s about understanding how competitors achieve the same features more efficiently. This white paper shows how engineering and value teams use verified teardown intelligence to make confident, market-validated cost decisions.
AI at TechInsights: January 2026 Review
Highlights of the AI coverage at TechInsights in January 2026: transition from AI experimentation to industrial-scale execution, Rubin GPU platform, Maia 200 AI chip, and Nvidia's AI revenue forecasts.