Latest Blogs and Commentary
2026 Fall CMC Seminar Singapore | Semiconductor Supply Chains
Join the 2026 Fall CMC Seminar in Singapore on October 28. Explore semiconductor materials, supply chains, quality, metrology, and sustainability.
Huawei Pura X Max - Exclusive Video
Exclusive content of the Huawei Pura X Max highlights new features, battery, and triple-camera system.
Qualcomm QPM7375A-001 MHB L-PAMiD Exploratory Analysis
Qualcomm QPM7375A-001 MHB L-PAMiD Exploratory Analysis, a multi-die module packaged in a 56-pin LGA.
Samsung Galaxy S26 Ultra (SM-S948U) Mobile RF Architecture
Mobile RF Architecture Analysis report of the Samsung Galaxy S26 Ultra Smartphone contains block-level schematic of the Cellular/Wi-Fi/BT RF paths.
Summary - Xiaomi Redmi Turbo 5 Max (2602BRT18C) Survey Plus Teardown
Summary Survey Plus Report of the Xiaomi Redmi Turbo 5 Max includes device observations, analysis summary, selected die photos, and more.
The Chip Insider®–Huawei’s Strategic Assault on Moore’s Law
Discover how Huawei’s LogicFolding push reframes Moore’s Law, spotlighting speed through advanced packaging amid rising cost, thermal, and EDA challenges
Xiaomi Redmi Turbo 5 Max (2602BRT18C) Survey Plus Teardown
Survey Plus Report of the Xiaomi Redmi Turbo 5 Max includes device observations, analysis summary, selected die photos, and more.
2025 IM LS9 Nvidia Thor based ADAS Controller Design Material Assembly
Design Material Assembly report of the 2025 IM LS9 includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.
2025 IM LS9 Nvidia Thor based Controller Deep Dive Teardown
Deep dive teardown of the 2025 IM LS9 includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.
Qualcomm Snapdragon 8 Elite Gen 5 GPU SoC Design Analysis
SoC Design Analysis of the SM8850 die found inside the Qualcomm Snapdragon Elite Gen5 Processor provides analysis of the standard cells of the GPU area.
Free Access to Five Key Reports – Curated Each Month 🆓
Free Access to Five Key Reports – Curated Each Month 🆓 2 Min Read June 03, 2026 Junes five pieces of high-value analysis available to registered users for free. Each month, TechInsights selects five pieces of high-value analysis to make available to
Editorial: IBM Arms Up Next-Gen Z Systems CPU
IBM is evolving its decades‑long Z architecture by integrating AArch64, enabling native Arm execution within its mainframe platform.
Slides: DRAM Market Report Q2 2026
Quarterly DRAM report analyzes supply, demand, pricing, and market share across key segments, tracking capacity, trends, and technology shifts.
Analysis: AI Boom Drives Rising Revenues, ASPs, and Equipment Sales
Semiconductor equipment orders held steady this week at an index level of 98.
Ambiq Beta Release AI-Codec compressionKIT™ Cuts Edge AI Memory and Power Substantially
Ambiq compressionKIT targets edge devices with AI‑based data compression to address memory, power, and transmission constraints in always‑on workloads.
The Chip Insider®–Huawei’s Strategic Assault on Moore’s Law
Huawei promotes advanced packaging as a path beyond Moore’s Law, highlighting scaling limits while raising questions around EDA capabilities and thermal challenges.
Snapdragon Wear Elite Elevates AI and Connectivity
Snapdragon Wear Elite advances Qualcomm’s wearable strategy with 3nm design, on‑device AI, and broader connectivity for premium and new form factors.
How 800V+ Architecture is Redrawing the EV Landscape
EV platforms are shifting to 800–1000V architectures, improving efficiency and charging speed while driving SiC and GaN adoption across power systems.