Latest Blogs and Commentary
Automotive Semiconductor Shifts & AI Workloads | TechInsights AWS Seminar
Join TechInsights on April 23 for an exclusive AWS automotive seminar exploring compute architecture shifts, semiconductor demand, and implications for AI workloads and cloud strategy.
Global AI Compute Power: Capability Meets Policy
Explore how global AI compute power is shaped by semiconductor capability, foundry capacity, and export controls in this TechInsights webinar.
NVIDIA GB10 Superchip (from DGX Spark, TSMC 3nm) Process Analysis
Summary of key findings off NVIDIA GB10 Superchip with detailed look at the FEOL, MOL, and BEOL structures and materials used.
Summary - Samsung Galaxy A07 5G (SM-A076B) Survey Plus Teardown
Survey Plus Reports of The Samsung Galaxy A07 5G includes device observations, analysis summary, major IC manufacturer distribution, and more.
Summary - Samsung Galaxy TriFold (SM-F968U1) Survey Plus Teardown
Survey Plus Reports of The Samsung Galaxy Z TriFold includes device observations, analysis summary, major IC manufacturer distribution, and more.
SmartSens SC485SL Device Essentials Folder
SmartSens SC485SL delivers 40 MP clarity with large 2.9µm pixels and back-illuminated design, powering high‑quality mobile, IoT, and surveillance imaging.
Summary - Vivo X300 Pro (V2502A) Deep Dive Teardown
Vivo X300 Pro targets the premium global market, debuting MediaTek’s Dimensity 9500 with a 6.8″ display and triple‑camera system.
The Chip Insider®– The Iran War’s Helium disconnect: Impactful or nothing burger?
One of the big problems for the semiconductor industry emerging out of the Iran War is the inability to get Helium through the Strait of Hormuz… The strategic question is, how impactful is Qatar’s helium disconnection from the world likely to be on semiconductor sales this year?
Summary - Tecno Spark Go 3 (KN3) Survey Plus Teardown
Survey Plus Reports of The Tecno Spark Go 3 includes device observations, analysis summary, major IC manufacturer distribution, and more.
Huawei DRAGON99 90-nm BCD Wireless Charging IC (Pura 80 Pro) PMIC Essentials
Power essentials report on the Huawei DRAGON99 device: relevant for chip fabrication, foundries, capital equipment, fabless, and IDM chip designers.
Your Top Questions About Carbon Trust Assurance for EcoInsights Answered
TechInsights recently hosted a live webinar with Carbon Trust experts to discuss the addition of third-party assurance to the EcoInsights platform — a milestone that marks a new standard for credibility in semiconductor product carbon footprint (PCF) reporting. Here are the most important questions from that conversation, answered.
Summary - Oppo A6 Pro 5G (CPH2827) Survey Plus Teardown
Survey Plus Reports of the The Oppo A6 Pro (5G) features analysis summary, RF block diagrams, ICs and RF modules, and more.
HiSilicon T303283F1 FR1 RF Transceiver RFIC Process Analysis
RFIC process analysis on the HiSilicon T303283F1 die includes process type, transistor gate length, and minimum metal and gate pitches.
Infineon CYW55913 AIROC Wi-Fi 6E/BT 5.4 LE Combo SoC Floorplan Analysis
CYW55913 packs a 192MHz Cortex‑M33 with Wi‑Fi 6E and BLE 5.4, enabling secure, ultra‑low‑power connectivity for advanced IoT designs.
Ultrahuman Re-Enters US Smart Ring Market with Ring Pro
Ultrahuman re‑enters the US with Ring Pro, positioning a redesigned smart ring as an alternative to Oura as demand grows for passive health tracking.
SES Taps K2 Space to Accelerate Next-Gen MEO Satellite Network, meoSphere
SES unveils meoSphere, a MEO 5G‑NTN network built with partners to blend multi‑orbit satellites and terrestrial systems for mobile operators.
Analysis: Capex Boom Continues
Weekly, monthly, quarterly, and yearly views and analysis to help manage the supply chain.
Samsung updates 2nd tier Exynos Mobile Processor, launches with latest Galaxy A57 5G
Samsung unveiled the Exynos 1680, and looks to differentiate itself from competitors through vertical integration strategy.