Latest Blogs and Commentary
Data-Supported Energy Efficiency Leads to Tool Upsell Contract
With rising environmental pressures and Scope 3 reporting requirements, fabs and foundries began prioritizing capital equipment purchases based on carbon footprint and energy performance.
A Fabless Company Wins More Business with Scalable, ISO-Compliant PCFs
As customer expectations around sustainability continued to evolve, this Fabless vendor found itself facing increasingly complex demands during procurement cycles.
TechInsights’ Sustainability Tools Used to Drive Down Carbon Emissions in the Supply Chain
This fabless vendor was up against a tight deadline to deliver a full cradle-to-gate carbon emissions analysis of nearly 100 integrated circuits (ICs) to satisfy several customers’ reporting requirements.
Identifying Emissions and Creating Reduction Plans Helps Win New Business
As customer demand for carbon transparency intensified, a leading semiconductor foundry faced mounting pressure to provide detailed, product-specific emissions data to support downstream carbon reduction strategies.
The Chip Insider®– A Tribute to Barry Rapozo
An industry sales legend is gone: Barry Rapozo passed on June 22, 2025, at the age of 80. Barry's career spanned many of the semiconductor equipment industry's icons, including IMS, GCA, KLA, and TEL, where he was instrumental in their growth and, in some cases, lack of it after he left
Delivering Required Die Emissions to Downstream Customers, Preserving Trade Secrets
A leading semiconductor foundry was facing mounting pressure from hundreds of downstream customers—including fabless companies, IDMs, and product manufacturers—who were demanding increasingly detailed carbon emissions data.
Meeting Customer PCF Requirements
As sustainability expectations rose across the electronics supply chain, one Integrated Device Manufacturer (IDM) found itself under increasing pressure from downstream customers to deliver standardized and transparent Product Carbon Footprints (PCFs) for its devices.
Identifying Scope 3 Emissions Hotspots
A leading Integrated Device Manufacturer (IDM) faced growing pressure to meet its sustainability goals while managing a complex global manufacturing network.
Xiaomi Xring 01 SoC Floorplan Analysis
Explore the Xiaomi Xring O1 chip, built on TSMC’s N3E node with 10-core CPU & 16-core GPU. See full teardown, layout, and cost analysis.
Insight: Qualcomm is Accelerating the Software-Defined Vehicle Revolution in China
Discover Qualcomm’s push for software-defined vehicles—insights from the 2025 Suzhou summit and China’s cockpit SoC trends.
Market Data: Smartphone Apps Processor Market Tracker
Explore Q1 2025 smartphone AP growth—unit shipments up 4%, revenue up 10% on stronger mix. Tracks 18 vendors with forecasts through Q4 2025.
Microprocessor Report June 2025 Review
Explore key chip insights—from Intel and AMD server CPUs to Meta’s AR tech and silicon photonics.
AI at TechInsights: June 2025 Review
Stay ahead in AI chips—see how global tensions and major deals from Qualcomm, AMD, and OpenAI are reshaping the market. Read TechInsights' June 2025 analysis.
2025-07-10 - Electronics and Macroeconomy Forecast Q2 2025
Get quarterly forecasts on global electronics production with insights by application, plus key macroeconomic, GDP, and PPP data.
Narrative: Smartphone Application Processor Market Share Q1 2025
The smartphone applications processor market grew 4% in units and 10% in revenue in Q1 2025, driven by flagship devices and AI-enabled silicon. Report tracks shipments, revenue, and forecasts.
Murata HFQFELEFC-643 UHB L-PAMiF Packaging Analysis
This package analysis report examines the Murata HFQFELEFC-643 UHB RF power amplifier module with LNA and integrated filters, designed for 4G LTE and 5G NR applications.
2025 Sensors – Image Signal Processor Briefing 1
This briefing examines TechInsights’ ISP device analyses from Dec 2024 to June 2025, covering floorplan strategies, block area efficiency, technology trends, and reverse engineering roadmaps.
Samsung Introduces Galaxy Z Fold7, Z Flip7, Flip7 FE
Samsung’s Galaxy Z Fold 7 and Flip 7 flagship foldables feature larger displays, improved cameras, slimmer designs, and AI enhancements. The affordable Flip7 FE was also introduced.
