Latest Blogs and Commentary
Memory Technology Roadmap Webinar | DRAM, NAND, HBM & Emerging Memory
Join TechInsights for an in-depth webinar on DRAM, NAND, HBM, and emerging memory technologies. Explore AI-driven innovation, scaling challenges, and the future of semiconductor memory with Dr. Jeongdong Choe.
Snapdragon X2 Elite Extreme Advanced Packaging Analysis: Examining Qualcomm’s SiP Approach
Compared with the previous-generation Snapdragon X Elite, Qualcomm has changed how the system-on-chip (SoC) is packaged. TechInsights performed an advanced packaging analysis to understand Qualcomm's latest packaging approach.
How China Is Closing the RF Front-End Acoustic Wave Filter Gap
See how China's RF front-end industry is advancing acoustic wave filter capabilities and what TechInsights' analysis reveals about OnMicro's capabilities.
How Qorvo's 3D RF-SOI Architecture Is Redefining Smartphone RF Front-End Design
TechInsights reverse engineering reveals the 3D RF-SOI architecture behind Qorvo's latest antenna tuner. Explore exclusive process, circuit, and packaging insights on the TechInsights Platform.
The Chip Insider®– Dr. Strange-AI-Guys, or How I Learned to Stop Worrying and Love AI
Inside G. Dan Hutcheson’s latest analysis, the AI-driven semiconductor boom reveals more than surging chip demand, highlighting how structural industry shifts, hyperscaler growth, and the end of Moore’s Law are reshaping the market far beyond typical cycle concerns
Beyond the Leading Edge: The Overlooked Opportunity in Mature-Node Decarbonization
Leading-edge processes dominate conversations about semiconductor sustainability, but mature-node chip manufacturing will remain responsible for a significant share of fabrication emissions through 2030. See why decarbonizing mature-node production is essential.
Comparing the Latest 200 MP Image Sensor Technology: Samsung, Sony, and OmniVision
Compare Samsung, Sony, and OmniVision's leading 200 MP CMOS image sensor technology through TechInsights' reverse engineering.
Huawei Pura 80 Teardown | BOM Analysis & Reverse Engineering
Explore the TechInsights Huawei Pura 80 teardown, including its undisclosed application processor, camera-heavy bill of materials (BOM), mixed domestic/import memory sourcing, and full cost breakdown.
NVIDIA HGX B300 Benchmarking for AI Infrastructure
Access TechInsights' NVIDIA HGX B300 benchmarking analysis to evaluate AI infrastructure performance, power, thermal behavior, and multi-GPU scaling.
2nm Process Comparison Webinar: Intel 18A vs Samsung SF2
Compare Intel 18A, Samsung SF2, and TSMC N2 using TechInsights teardown, yield, floorplan, and manufacturing analysis. Free webinar July 23, 2026.
Samsung Galaxy Z Fold8 Analysis | Foldable Technology & Upcoming Teardown
Learn what's new in the Samsung Galaxy Z Fold8 and preview the upcoming TechInsights teardown. Access the Galaxy Z Fold7 Teardown Report and explore expert BOM analysis, supplier insights, and reverse engineering.
The Chip Insider®– UV’s Geopolitical Horizons
Inside G. Dan Hutcheson’s latest analysis, ASML’s Hi-NA EUV progress underscores more than lithography innovation, revealing how geopolitical tensions are emerging as the primary challenge to a critical semiconductor and AI chokepoint.
Three Automotive Semiconductor Trends Shaping the Market in 2026
Three automotive semiconductor market trends to watch out for in 2026: supply risk, China market access, and vehicle architecture change.
Top IC Manufacturing Equipment Suppliers in 2025
Explore the top IC manufacturing equipment suppliers in 2025 and the market trends driving industry growth. Access TechInsights Total Equipment Market Share Database.
Component-Level Benchmarking: What Teardown Analysis Reveals About Competitor Materials, Assembly, and Repairability Design
Learn how teardown analysis reveals what competitors actually built and the component-level costs behind those choices
Foldable OLED Market: Why Samsung Display's Flex Titanium Matters
See how Samsung Display's Flex Titanium reflects broader changes in the foldable OLED market, where materials innovation is becoming a key differentiator.
What's Inside Competing Products
See how engineering and QA teams use teardown analysis to inform better design decisions. Download the white paper.
The Carbon Calculus of Chiplets: When Modularity Meets Environmental Impact
Explore whether chiplet-based architectures are improving semiconductor sustainability through yield-complexity tradeoffs, featuring a case study on the Apple M5 Pro architecture.