iPhone 14 Pro's New Ambient Light Sensor – Inside the Package

Apple’s annual big reveal in September 2022 promised an iPhone 14 with “a re-engineered proximity sensor”, detecting light from behind the display to save additional space. This is the type of announcement the CIS subscription likes to hear about, and indeed our initial teardown analysis showed that Apple decided to change their approach to the proximity sensor.
25Jan

The Continuously Evolving Landscape of Memory Technology

The memory technology landscape is continuously evolving. DRAM and NAND Flash memory demands have been steadily increasing and emerging memory markets such as STT-MRAM, ReRAM, PCRAM, FeRAM, and 3D XPoint memory are expected to reach $36 billion by 2030. As emerging memory makers race ahead of device scaling, they will face several challenges.
24Jan

A Trip Down TSMC Memory Lane – Part 2

Logic Blog A Trip Down TSMC Memory Lane – Part 2 Dick James To start Part 2 of the blog, we backtrack to 1998, when the 0.25-µm process was launched. One of the comments from Shang-Yi Chiang’s (former VP of R&D at TSMC) oral history was that when he joined in 1997, TSMC could not get papers accepted
05Jan

Mobile RF Year in Review - Who Made Our Top Picks for 2022?

Mobile RF Blog Mobile RF Year in Review - Who Made Our Top Picks for 2022? 2022 has been a busy year in the mobile RF landscape. TechInsights’ team of subject- matter experts and analysts have been hard at work identifying the key events, technologies, and design practices to include as part of the
20Dec

Google Pixel Watch

Discover the Google Pixel Watch's cutting-edge technology with our in-depth forecast and teardown analysis. Explore its design, components, and performance in this comprehensive TechInsights eBook.
19Dec

Disruptive Event - Stratio BeyonSense SWIR Camera

The BeyonSense Short Wave Infra-Red (SWIR) Sensor is part of a new generation of image sensors that capture light beyond the visible spectrum enabling imaging and sensing devices to see beyond the visible spectrum and into the internal structure of an object.
14Dec