AutoSens Brussels 2022

TechInsights recently attended AutoSens Brussels 2022, held September 12-15th at Autoworld in central Brussels. This blog provides some highlights of recent CMOS Image Sensors developments and trends from the event.
23Sep

Apple iPhone 14 Teardown

The Apple iPhone 14 launch marks the first time Apple launched an iPhone product series with two different processors. The iPhone 14 base models have last year’s Apple A15 Bionic processor, and the more expensive 14 Pro models have the newest Apple 16 Bionic processor. TechInsights has several ongoing Teardowns on the new iPhone 14 series models.
21Sep

Sony IMX662 Image Sensor

Security and surveillance camera equipment is frequently required to perform in challenging lighting conditions. Based on multiple customers demands for performance upgrades to their STARVIS system, Sony have developed the IMX662, the latest from the STARVIS 2 family of image sensors.
15Sep

Samsung HKMG DDR5 DRAM

Samsung’s HKMG DDR5 is the most advanced DRAM product available. Based on the successes of this device design, HKMG is likely set to become the new standard in DRAM manufacturing. Learn more about this technology innovation here.
14Sep

Apple M1 Ultra Advanced Packaging

Packaging has become more sophisticated and a differentiator in the overall performance of advanced SoC chipsets. It can significantly impact form factor, helping to miniaturize designs in the multichip package and improve chip-chip RC delay. The Ultra is the first example of a device utilizing InFO-L technology that TechInsights has documented.
08Sep