Leading TechInsights' Analysts Gear Up for CES® 2024
TechInsights is excited to announce that some of our leading analysts specializing in Consumer Electronics, Automotive, and Mobile will be making their way to CES® 2024.
Disruptive Technology: 7nm SMIC MinerVa Bitcoin Miner
TechInsights has discovered what appears to be SMIC 7nm technology in the MinerVa Bitcoin Miner SoC. Learn why this matters and its market impact by downloading our Disruptive Technology Brief today.
Webinar - Memory Process and Integration Challenges: DRAM & NAND
In this Memory webinar, Dr. Jeongdong Choe gave an overview and discussed the latest memory technology trends and challenges, focusing on DRAM and NAND devices.
Apple iPad Pro Teardown
In this year’s iPad Pro, the new 12.9” mini-LED display and new TrueDepth camera system may be taking ‘Center Stage’ for many users, TechInsights will continue to look deeper for other semiconductor and design winners inside the new iPad Pro.
Apple iPhone 18 Rumors: Pro, A20 and Foldable Preview
Explore Apple iPhone 18 Pro and foldable iPhone rumors, including the A20 Pro, 2 nm silicon, C2 modem, cameras, memory, suppliers, and release strategy.
OpenAI Jalapeño: The Architectural Decisions Behind Its Inference Efficiency
OpenAI Jalapeño's benchmark results have attracted attention, and a closer look at the design choices provides important context for understanding the performance. This article presents TechInsights’ commentary on the decisions disclosed at Hot Chips.
What a Die-level Analysis Reveals About Apple's M5 Pro GPU Design
When Apple announced the processor, much of the discussion focused on how the two dies were connected and the role of TSMC's SoIC-X face-to-face (F2F) hybrid bonding technology. The next question is how Apple laid out the GPU die, which we examined in our latest Digital Floorplan Quick Look (DFQ).
The Chip Insider®– Risk of an AI Bubble
Inside G. Dan Hutcheson’s latest analysis, he explains why the AI boom bears all the hallmarks of a bubble, tracing its unprecedented rise from millions to over $100 billion and exploring how lasting value is created long after market speculation fades.
Don’t Let Carbon Compliance Cost You Customers: The New Rules for Semiconductor Supply Chains
Accurate carbon reporting is now required across the semiconductor supply chain. Learn how to build an auditable data strategy to maintain your market position.
HiSilicon Kirin 9030 Pro Process Flow Analysis: How Does SMIC’s N+3 Process Compare to Leading-Edge Nodes?
How does SMIC N+3 compare with other leading-edge nodes? A process flow analysis of the Kirin 9030 Pro provides the measured layer-by-layer evidence.
Intel Core Ultra X7 358H Microprocessor: Evaluating the Foveros-S 2.5D packaging technology
The Intel Core Ultra X7 358H combines three active tiles in a single Foveros-S 2.5D package. TechInsights’ Advanced Packaging Quick Look documents how Intel implemented the package, including its materials, interconnects, and structural design.
