The Chip Insider®–The Iran War’s Helium disconnect update
Explore how the Iran War’s helium shock raised supply concerns, yet 10 weeks in, resilient supply chains have kept semiconductor sales, production, and costs largely unaffected.
The End of the Carbon Estimate: Why Semiconductor Procurement Now Requires Hard Data
A recent shift in EU sustainability regulations shows carbon reporting is evolving into a supplier deliverable, requiring semiconductor companies to provide precise, product-level emissions data.
2026 Global Semiconductor Supplier Awards
Since 1988, the Global Semiconductor Supplier Awards have served as the industry’s most trusted independent benchmark for supplier performance, originally established by VLSI Research and now powered by TechInsights.
The Chip Insider®–The New Intel Trinity. Hi-NA too expensive? The TSMC controversy and the inside story.
Discover how Intel’s leadership trio drives strong earnings, better yields, and smarter strategy—raising big questions around Hi‑NA costs and timing.
The Chip Insider®– 4 Chips Acts = 2 Successes + 2 Failures with lessons to learn.
G. Dan Hutcheson dives into China, US, EU, and Japan's responses to the global world chip order in the recent The Chip Insider®.
Carbon in the Age of AI Chips
In 2026, the biggest carbon decisions in semiconductor design aren't made at the reporting stage — they're made at the design table. AI accelerators, high-bandwidth memory, and advanced node manufacturing are concentrating embodied emissions faster than most teams can measure. This Earth Day, TechInsights' sustainability experts break it down.
Sourcing Intelligence from the Inside Out
How product manufacturers use teardown analysis to uncover supplier relationships, component strategies, and real-world sourcing decisions.
What's Actually Inside Your Competitor's Product? How Manufacturers Use Teardown Analysis to Decode Supplier Strategies
Device teardown analysis physically disassembles competitor products and identifies the components inside them. Not estimated sourcing. Not inferred supply relationships. Verified component identification with supplier attribution across the full bill of materials.
The Chip Insider®–How chips got to $1T
Key insights from industry expert G. Dan Hutcheson - analyzing the shift from Cost-Driven to a Value-Driven business model and the major inflection points in semiconductor growth.
What’s Really Inside Your Competitor’s Product?
Explore the Samsung Galaxy S25 and Google Pixel 9 Pro through detailed teardown analysis, including costed BOMs, chip-level insights, and component sourcing.
