SK hynix Powers Huawei Mate 60 Pro
TechInsights Unveils Memory Secrets
In the fast-paced world of smartphone innovation, it's often the components inside that make all the difference. Huawei's latest flagship, the Mate 60 Pro, has been under TechInsights' scrutiny, revealing an interesting connection to SK hynix memory components. As we dive into the details, we find that these components are more than meets the eye.
As of our latest analysis, the Mate 60 Pro exclusively features SK hynix memory components. Let's break down the key findings:
H583TD64M DRAM Die: This component, showcased in Figure 1 (package) and Figure 3, a die marking exclusive to the TechInsights Platform, boasts the SK hynix D1z process. It's a testament to SK hynix's cutting-edge memory technology, as previously documented in our analyses.
H25FTC0 NAND Die: The Mate 60 Pro's NAND memory, seen in Figure 2 (package) and Figure 4, a die marking exclusive to the TechInsights Platform, relies on SK hynix's 176-Layer TLC 4D NAND process. This represents a significant leap in storage capacity and performance.
What's intriguing is that the H583TD64M DRAM die made its debut in Lenovo's Legion 2 Pro smartphone in 2021, indicating its early adoption. Since then, this memory component has found its way into various flagship smartphones, including the Xiaomi 12 Pro (2022), Huawei Mate X3 (April 2023), and Huawei P60 Pro (June 2023). Remarkably, the Mate 60 Pro marks the third Huawei phone this year to feature the H583TD64M. It's clear that this component has established itself in the Asian market over the past few years.
The Mate 60 Pro's choice of SK hynix memory components underscores their role in shaping the smartphone experience. These components contribute to the device's speed, efficiency, and overall performance.
For a deeper dive into our analysis of the Huawei Mate 60 Pro and to explore more intriguing tech insights, visit our Platform's Special Content area. Stay tuned for further revelations as we continue to dissect the world of technology and teardowns.
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