Newsroom

MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing, MediaTek holds 14% of the global cellular baseband

How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.

The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly storing and processing very sensitive and private user

新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。

This deal has been years in the making. China's BOE Technology Group has been angling to supply Apple with OLED displays destined for iPhones since early 2017.

According to agency analysis, the 4G version is Huawei's first smartphone product without US parts, while the 5G version still uses some American-made components, the proportion is ...

From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.

Huawei Leads Imaging Chip Area Arms Race, Sony Wins Big with i-ToF, Emergence of Event-Driven Vision Sensors Posted: December 18, 2019 Contributing Authors: Ray Fontaine, Senior Technology Analyst Samsung, Huawei and Apple continue to push more imaging-related silicon into their flagship smartphone

Different approaches for breaking down the memory wall.

Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.

Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations , are driving innovation in the USB adapter market. The USB-C power delivery standards are a further driver for innovation in this

集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。