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Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees. Arabinda was first up, giving a talk on the “ 10

Posted: April 10, 2018 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L 3D FG/PUC NAND Flash Technology Professionals We

Posted: April 9, 2018 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world’s first 5G mobile handset in Korea - the Samsung

April 9, 2019 / 2:00pm to 3:00pm ET In this webinar, we will look at the key structural elements of the two packaging solutions. Package cross-sections and RDL delayering images will be presented and discussed, which will provide attendees with an understanding of the proposed structures, and of the

Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support the evolving LTE standard. Smartphones need to

April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this technology has traditionally been used in low-to-medium pin count applications,

(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due to a higher number of 3D gate stacks and multi

Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.

In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...

Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in our labs since early this morning. We are excited

On Monday, 25 February, researchers outlined the future of computers and computing during the opening plenary sessions of the 2019 Advanced Lithography conference. Speakers discussed challenges ahead, highlighting the need for an intelligent application of lithography and nanopatterning.

Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell out of 220,000 of their highly anticipated Lenovo