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Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we are excited to say that we have found Samsung’s

Originally Posted: March 12,2020 TechInsights is excited to announce we have found the first Yangtze Memory Technologies Co. (YMTC) 3D 64L Xtacking TLC NAND device, and our extensive analysis on this market-disrupting part is under way. With this device, YMTC has become China's first mass-producer

Contributing Authors: Ray Fontaine Congratulations to the Samsung team for not only delivering a well spec’d camera system, but also for being first to market with 0.7 µm generation pixels! The GH1 stacked imager, announced in September 2019 , is in use in the S20 Ultra 5Gs front-facing camera.

Contributing Authors: Daniel Yang, Ray Fontaine It is an especially busy time in TechInsights’ labs. Just a few days after we started the teardown of various models of the Xiaomi Mi 10 flagship series - the world’s first Qualcomm Snapdragon 865 platform phone that also supports LPDDR5 - we now have

Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors. TechInsights has compiled a briefing on Samsung’s

Here we were, waiting for the release of the Samsung Galaxy S20 so we could see the Qualcomm Snapdragon 865 mobile platform, and along came Xiaomi with their announcement on February 13 that the Mi 10 - also based on the Snapdragon 865 - would be available (very) soon. We waited days - not weeks -

Apple Inc’s surprise warning that it will likely fall short of this quarter’s sales target due to the coronavirus epidemic points to much pain for its chip and other suppliers as well as for rivals who also rely on China to build their products.

MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing, MediaTek holds 14% of the global cellular baseband

How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.

The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly storing and processing very sensitive and private user

新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。