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An Examination of the Technical and Financial implications of the Apple iPhone 12 November 10, 2020 This webinar is presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most ambitious iPhone to date, iPhone 12

ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will examine some of the different structures we have

The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last two articles to review the modern mobile phone

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog content to TechInsights Memory subscribers. October 15

Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung introduced us to the Sony IMX516 i-ToF in Q4 2019

Contributed by: Sinjin Dixon-Warren, PhD The emergence of gallium nitride (GaN) technology in the USB-C chargers is a new trend in the semiconductor market. Over the past year, TechInsights has found GaN technology from Navitas and from Power Integrations in various USB chargers, as published in

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog content to TechInsights Memory subscribers. October 8

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog content to TechInsights Memory subscribers. September 25

Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to TechStream blog content for subscribers

Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying complexity challenges. Regarding 5G mmWave transceivers

Semiconductor Engineering - Various memories and business outlooks are all over the map, sometimes literally, with lots of confusion ahead.

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral circuits are stacked under the cell, resulting in