Latest Blogs and Commentary
Webinar: Inside the iPhone 18 Pro and Pro Max
Join TechInsights on October 14 for preliminary iPhone 18 Pro and Pro Max teardown findings covering the A20 Pro, cameras, connectivity, memory, suppliers, packaging, and device cost.
Insightful Fact Checker
Fact-check semiconductor articles with the Insightful Fact Checker. Verify claims and track changes to components and suppliers using TechInsights analyses.
AI Demand Is Rewriting the CAPEX Roadmap.
Get the latest 2026 CAPEX Forecast: growth projections for Advanced Logic & Foundry, DRAM, NAND/NVM, and Discrete, Analog, and Other CAPEX.
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Key Cloud and Digital Services Revenue to Exceed $5 Trillion in 2031
AI-driven demand is pushing cloud and digital services beyond previous growth expectations. TechInsights forecasts the worldwide market will exceed $5 trillion in annual revenue by 2031, led by continued growth across cloud computing, SaaS, social media, and search.
The Chip Insider®– State of the Semiconductor Union
Inside G. Dan Hutcheson’s latest analysis, the seven layers of the Semiconductor Demand Stack reveal an industry at remarkable highs, as AI demand, semiconductor growth, economic conditions, and geopolitical risks shape the outlook for the cycle ahead.
The Hidden Complexity of the Power GaN Manufacturing Ecosystem Revealed by Technical Analyses
Whose GaN is it anyway? TechInsights brings together technical analyses to examine the die-supplier relationships behind devices from leading power GaN manufacturers.
The Chip Insider®– Strategic implications of ASML’s 12-inch EUV reticle and the TSMC-Intel War
Inside G. Dan Hutcheson’s latest analysis: Intel is moving early on High-NA EUV while TSMC holds back, the next technology cycle raises a familiar question: How much could lithography influence the competitive race?
How Software-Defined Vehicles Are Reshaping the Automotive Value Chain
The automotive software market is reshaping the value chain. See what changing architectures and demand mean for semiconductor suppliers through 2033.
Inside the iPhone 18 Pro Max Silicon Strategy
Explore the custom silicon, semiconductor design wins, supplier relationships, and system architecture behind the iPhone 18 Pro Max.
What Teardown Data Actually Confirms About New Technology Adoption
Learn how teardown data from 15,000+ devices confirms which sensor and display technologies are moving from roadmaps into shipping products.
Meet the TechInsights team at SEMICON West 2026
We’re ready to discuss everything from manufacturing analysis to sustainability, and more, across the semiconductor supply chain.
The Chip Insider®– Memories: How Korea and SK hynix rose to dominance in HBM
Inside G. Dan Hutcheson’s latest analysis, the rise of HBM reveals how SK hynix and Korea transformed memory from a commodity business into a strategic AI enabler, reshaping competition and industry economics.
Semiconductor Materials
Substitute a material, source around supply risk, or size a new market: TechInsights delivers the semiconductor-level intelligence to make the call with confidence.
What the iPhone 18 Pro Max Reveals for IDMs
Benchmark 2nm process technology, manufacturing execution, advanced packaging, memory integration, RF, and power-management innovation.
Hyperscalers
Hyperscalers are spending more on AI infrastructure than on any technology buildout in history, and the cost of a wrong call keeps rising. TechInsights gives engineering and R&D teams physical evidence of what the market's leaders are actually building.
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor
TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
Using Teardown Data to Confirm What’s Real, Not Just Announced
New sensor, display, and semiconductor technologies show up in roadmap conversations long before anyone can confirm they're shipping. This white paper shows how physical teardown evidence closes that gap for R&D and engineering teams.