At the end of Part 2 of the blog we had reached 2009 and the 40-nm generation; which put TSMC out of sync with other companies, who were marketing their 45-nm product. That discrepancy continued with the usual 70% shrink to the next node, 28-nm for TSMC and 32-nm for IDMs such as Intel and IBM.
AMD’s MI300 accelerator will compete with Nvidia's Grace Hopper in the HPC and AI markets. It uses AMD's third-generation CDNA3 architecture and features x86, GPU, and memory die in a single package for improved performance.
Recently, TechInsights hosted a Memory webinar where Dr. Jeongdong Choe, Senior Technical Fellow at TechInsights, discussed the latest memory technology trends and challenges for DRAM and NAND devices.
TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Caution dominates decision-making Shereen Vaux Order activity for semiconductor equipment held at a brisk 49 degrees The decline continues to moderate Memory slipped another degree in freezing levels while Other SOC compute fell two degrees Texas
Imagination Technologies’ DXT GPU increases raw performance by 50% over the prior CXT generation. Although ray tracing remained in the headlines, changes to other circuits are responsible for this higher throughput.