At the beginning of September we were pondering the rumors about a Samsung 5G modem that was predicted to show up on the US shores in the form of the 5G implementation solution for the yet to be released Google Pixel 6.

CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.

What's inside the Google Pixel 6 Pro Teardown? Contributing authors: Stacy Wegner, Daniel Yang, Radu Trandafir, Aakash Jani The much anticipated Google Pixel 6 Pro has arrived in our lab for teardown. This one took us some time to find! The phone used for the teardown is a Canadian model GA03161-CA

Apple's First GaN Charger Stephen Russell October 28, 2021 It has been heavily rumoured and anticipated for a few years now, but we have finally seen Apple make the switch to using gallium nitride (GaN) as the power transistor in one of their charging products. The 140 W charger for the new 16-inch

TechInsights and Bloomberg Intelligence Analysts presented their findings on this year’s Apple flagship phone, the iPhone 13 Pro, in this webinar presentation.

TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content OTTAWA, ON, October 14, 2021 - TechInsights Inc. is pleased to announce the acquisition of The Linley Group, Inc., an industry-leading source for independent technology analysis of the latest

YMTC 128L Xtacking 2.0 for SSD! Finally, they might catch up with Samsung, SK hynix, and KIOXIA Dr. Jeongdong Choe September 23, 2021 TechInsights just found and quickly reviewed YMTC 128L TLC die removed from Asgard Memory (Powev Electronic Technology Co.) PCIe4.0 NVMe1.4 AN4 1TB SSD with a double

We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below.

Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm eMRAM products with STT-MRAM technology and

NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND

Power Semiconductor Technology Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer a place for silicon (Si) in power electronics