Samsung Galaxy S23 Ultra Cameras

TechInsights has conducted an initial teardown analysis of the Samsung Galaxy S23 Ultra, with a focus on the phone's camera modules and optical sensors. This blog presents the preliminary findings of the teardown, revealing the specific components and manufacturers of the camera and sensor hardware found inside the phone.
03Mar

YMTC is a Leading Pioneer in 3D NAND

Dr. Jeongdong Choe penned the following article in December 2022. Technology moves quickly – here we are in March 2023, and it has just been announced that YMTC has received a huge cash infusion of $7 billion USD. We have also just received the Micron 232L NAND SSD, and will be reporting our findings shortly.
02Mar

2023 State of the Power Semiconductor Market

The Power semiconductor market is in for a difficult year with the high demand for vehicle electrification and clean energy, leaving power semiconductors in a shortage. Read the blog for TechInsights’ predictions and discoveries on market consolidation, which is a growing trend in terms of wide bandgap semiconductor material supply.
14Feb

A Trip Down TSMC Memory Lane – Part 3

At the end of Part 2 of the blog we had reached 2009 and the 40-nm generation; which put TSMC out of sync with other companies, who were marketing their 45-nm product. That discrepancy continued with the usual 70% shrink to the next node, 28-nm for TSMC and 32-nm for IDMs such as Intel and IBM.
07Feb

Mobile RF – 2022 Webinar Recap

TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.
02Feb

Hybrid Bonding Technology - 2023 and beyond

Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
01Feb