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Huawei Mate 10 Teardown

Huawei Mate 10 Teardown

Posted: October 26, 2017, Updated: November 15, 2017 Contributing Authors: Daniel Yang, Stacy Wegner Typically we save these kinds of full-court-press teardown events for an Apple or a Samsung Galaxy, and no doubt we are gearing up for iPhone X quick
October 31, 2017 Oct 31
Samsung Galaxy Note 4 & Alpha Teardown

Samsung Galaxy Note 4 & Alpha Teardown

Posted: October 17, 2014 Samsung Galaxy Note 4 , Galaxy Alpha, and Apple iPhone 6 Phones Samsung released their latest 5.7inch flagship Galaxy Note 4 ahead of schedule in South Korea, and then followed it up with the release of the Samsung Galaxy
October 17, 2017 Oct 17
Apple Watch Series 3 Teardown

Apple Watch Series 3 Teardown

Posted: September 13, 2017, Updated October 17, 2017 Contributing Authors: Daniel Yang, Stacy Wegner We have completed the Apple Watch Series 3 teardown. We were especially interested in its cellular functionality, and whether the LTE chipset
September 30, 2017 Sep 30
Apple iPhone 8 Plus Teardown

Apple iPhone 8 Plus Teardown

Posted: September 10, 2017, Updated: October 11, 2017 Contributing Authors: Daniel Yang, Stacy Wegner, Ray Fontaine A11 Bionic Application Processor Applications Processor The iPhone 8 Plus A1897 model we examined initially is confirmed to contain
September 12, 2017 Sep 12
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)

A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)

Posted: July 24, 2017 Contributing Authors: Ray Fontaine The third topic addressed in the IISW 2017 paper was an overview of the trends we’re seeing in pixel isolation structures. These structures are critical to the performance of 1.0 µm to 1.4 µm
July 24, 2017 Jul 24
The 10nm Process Rollout Continues to Evolve

The 10nm Process Rollout Continues to Evolve

Explore the latest advancements in 10nm semiconductor technology, including Samsung's 10nm LPE and TSMC's 10nm FinFET processes. Learn about their impact on mobile devices like the Galaxy S8 and iPad Pro2, and discover how these innovations are driving the semiconductor industry forward.
June 27, 2017 Jun 27
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)

A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)

Posted: June 21, 2017 Contributing Authors: Ray Fontaine At the time of the IISW paper submission deadline in April, we hadn’t yet received the Sony Xperia XZs with 3-layer stacked Motion Eye camera. The technology development had been announced at
June 21, 2017 Jun 21
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics

Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics

Posted: June 14, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25
June 14, 2017 Jun 14
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)

A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)

Posted: June 13, 2017 Contributing Authors: Ray Fontaine This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop. Don Scansen attended in 2007, under
June 13, 2017 Jun 13
Memory/Selector Elements for Intel Optane™ XPoint Memory

Memory/Selector Elements for Intel Optane™ XPoint Memory

Posted: June 07, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Figure 1. A comparison of memory density TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory
June 07, 2017 Jun 7
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation

SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation

Posted: June 05, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Die Photo SK hynix successively developed their 2nd generation 21 nm DRAM technology last year. Low yield and reliability issues on 21 nm 1st generation, means their
June 05, 2017 Jun 5
Intel 3D XPoint Memory Die Removed from Intel Optane™ PCM (Phase Change Memory)

Intel 3D XPoint Memory Die Removed from Intel Optane™ PCM (Phase Change Memory)

Posted: May 18, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Figure 1: Xpoint Memory Package Figure 2: Xpoint Memory Die (16 GB) TechInsights recently acquired and tore down an Intel OptaneTM M.2 80mm 16GB PCIe 3.0 and
May 18, 2017 May 18
Sony Launches First Three-Layer, 960 fps Camera with Sandwich-Stacked DRAM

Sony Launches First Three-Layer, 960 fps Camera with Sandwich-Stacked DRAM

Posted: May 2, 2017 Contributing Authors: Dick James, Fellow Emeritus During the ISSCC conference last February, Sony issued a press release describing “Industry's First 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones”. There have been
May 02, 2017 May 2
Qualcomm Snapdragon 835 First to 10 nm

Qualcomm Snapdragon 835 First to 10 nm

Posted: April 24, 2017 Contributing Authors: Andy Wei With the first set of Samsung Galaxy S8 teardowns, we have access now to the first SoCs produced on “10 nm” class technology. First to the 10 nm productization finish line is the Qualcomm
April 24, 2017 Apr 24
Samsung Galaxy S8 (SM-G950W) Teardown

Samsung Galaxy S8 Teardown (SM-G950W)

Posted: April 7, 2017, Updated: April 25, 2017 We are excited to announce receipt of our Galaxy S8. Our blog details teardown findings including cost observations, verification of the 10 nm LPE process, commentary on the Qualcomm WTR5975 Gigabit LTE
April 07, 2017 Apr 7
Nintendo Switch Teardown

Nintendo Switch Teardown

Discover what powers the Nintendo Switch in our detailed teardown. Explore key components, design choices, and semiconductor insights from inside one of the most popular gaming consoles.
March 03, 2017 Mar 3

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