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Competitive Technology Intelligence

Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)

Platform for the Semiconductor Industry

TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics

Intellectual Property
 

Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products

Latest Report Analysis

This report presents a basic floorplan analysis (BFR) of the Microchip Technology ATA8352 low-power UWB transceiver.
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
This report presents a digital floorplan analysis of the Kneron KL720 AI SoC processor fabricated using UMC's 28 nm HKMG CMOS process.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a package analysis (PKG) of the Sony IMX787 64 MP 35 mm rear main camera, extracted from the ZTE Nubia Z40. The ZTE Nubia Z40 is promoted as having the industry's first custom 35 mm lens.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."