Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.
SEMICON West recently wrapped up, and one of the notable programs focused on sustainability, which provided a platform for sharing insights, innovative solutions, and collaborative strategies to address environmental challenges.
The term ‘chiplet’ has come into use to describe an evolved design strategy moving past monolithic system-on-chip (SoC) to the heterogeneous integration of a disaggregated design in a system-in-package (SiP).
The semiconductor industry is facing a turning point with the rise of chiplet technology (also known as chiplet-based design or semiconductor chiplet technology). This revolutionary approach has been made possible by the advances in chip-to-chip interconnect and is poised to reshape chip production and design, particularly within the computing segment.
Despite political and national security concerns about US domestic semiconductor production, American companies continue to account for more than half of the global chip industry’s total spending on research and development, according to the latest annual analysis of R&D expenditures by TechInsights.
Intel’s Lunar Lake, the biggest overhaul of its architecture for PC processors since the addition of efficiency cores with Alder Lake, promises a big leap in power efficiency that may nullify AMD’s long-standing advantage in this metric.
Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.
Spatial computing is a highlight of the new Apple Vision Pro headset. This device uses various sensors to integrate virtual and physical environments by sensing the three-dimensional structure of the user's space and eye movements.
Dive into the latest Chip Observer for June 2024! Explore major advancements in AI PCs, competitive shifts in datacenter GPUs, and insights on the recovering memory market. Discover how NVIDIA’s dominance is being challenged and get the scoop on IBM’s strategic moves.
Discover the latest innovation from Samsung Foundry with their next-gen GAA process expected in the Galaxy Watch 7. TechInsights analysts provide insights from the Samsung Galaxy Unpacked Conference, building on last year's groundbreaking SF3E process technology.
Discover how Volkswagen’s $5 billion investment in Rivian could reshape its CARIAD software division, boost Android Automotive OS adoption, and influence future EV developments.
Semiconductor equipment order activity held at 87 °F last week. Memory remains the hottest segment. Advanced packaging continues gaining traction as the supply for AI is still catching up to demand.
Semiconductor sales increased 5% last week and were up 27% from this time last year. TechInsights forecasts Logic IC sales will increase 16% to $324 billion in 2024.
In the realm of integrated circuit design, scaling plays a pivotal role in driving technological advancement. Initially spurred by Moore's Law in 1965, which highlighted the economic feasibility of cramming more components into circuits, scaling has since evolved through constant innovation.
FinFET transistors, or Fin Field Effect Transistors, have revolutionized advanced semiconductor manufacturing by replacing planar FET transistors, starting with Intel's 22nm technology and later adopted by other foundries at the 16nm node.
Intel's i3 Process at the VLSI Technology Symposium: A Comparative Analysis Discover Intel's latest i3 process unveiled at the VLSI Technology Symposium, showcasing advancements in semiconductor technology. With enhanced transistor density and
