Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog

Dick James
Dick James, Fellow Emeritus
Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to TechStream blog content for subscribers.

September 25, 2020

At the recent Intel Architecture Day, Ramune Nagisetty revealed that Intel has been developing hybrid bonding technology to take it beyond the EMIB and Foveros technologies already in production.

This now means that two of the three largest chip manufacturers have hybrid bonding available – TSMC announced its SoIC platform a couple of years ago. Samsung is an Xperi licensee, though we don’t know if that includes their DBI® hybrid bonding.

Hybrid bonding went into volume production after Sony licensed the Zibond technology from Ziptronix (now part of Xperi) and introduced it almost five years ago into their CMOS image sensors (CIS) that use stacked sensor and image processors. Zibond was initially a wafer/wafer bonding technique focused on oxide/oxide interfaces, but it evolved to include copper/copper direct bonds, and Xperi rebranded it as Direct Bond Interconnect (DBI®). Not all companies use Xperi’s licensed technology, so the industry term for face/face wafer bonding with copper/copper interconnect has become “hybrid bonding” (HB). Now almost all of the stacked CIS manufacturers or their foundries have HB available. In the meantime, the process has evolved to give bonding pitches of >4 µm and pad diameters >2 µm.

Hybrid Bonding Expands from Image Sensors to Logic, Memory

 

Want to read more?

TechInsights Image Sensor subscribers already have access to exclusive TechStream content in the TechInsights Platform.

 

Platform Subscriber Login

 

 

 

Not a subscriber?

Contact us today to learn more about our Image Sensor analysis, and to request access to the rest of this article.

 

Contact us

 

Memory Subscription

Image Sensor Subscription

Logic Subscription

A TechInsights subscription gives you the data you need - instantly.


Exclusive commentary on the latest technology developments from our experts


Access to the world’s largest library of semiconductor and advanced technology analysis


Comprehensive technology analysis to enable you to make fact-based decisions on your biggest investments

Stay up to date with the latest news and updates from TechInsights