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GaN, SiC, and Si technologies in AC Adapters

GaN, SiC, and Si technologies in AC Adapters

Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device
August 14, 2019 Aug 14
Huawei Mate 20 X Teardown

Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown

2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung
August 02, 2019 Aug 2
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)

Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)

4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image
July 30, 2019 Jul 30
Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)

Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)

4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the
July 23, 2019 Jul 23
Part 2: Pixel Scaling and Scaling Enablers

Part 2: Pixel Scaling and Scaling Enablers

4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop
July 16, 2019 Jul 16
Part 1: Chip-stacking and chip-to-chip interconnect

Part 1: Chip-stacking and chip-to-chip interconnect

4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image
July 09, 2019 Jul 9
TechInsights memory technology update from IEDM18

TechInsights memory technology update from IEDM18

Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees
April 11, 2019 Apr 11
Samsung Galaxy S10 5G Teardown

Samsung Galaxy S10 5G Teardown

Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world
April 09, 2019 Apr 9
Analyzing innovations in mobile radio frequency front-end integration

Analyzing innovations in mobile radio frequency front-end integration

Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support
April 09, 2019 Apr 9
Samsung Galaxy S10+ Teardown

Samsung Galaxy S10+ Teardown

EXPERIENCE THE WEBINAR The Samsung Galaxy S23 Ultra - Inside the Flagship April 5, 2023 In this exclusive webinar, our experts will deliver an in-depth analysis of the components within this device, highlight what changed from previous versions, and
March 01, 2019 Mar 1
Lenovo Brings the New Snapdragon to Market

Lenovo Brings the New Snapdragon to Market

Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell
February 20, 2019 Feb 20
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger

Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger

Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to
February 07, 2019 Feb 7
Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication

Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication

Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and
February 07, 2019 Feb 7
The Evolution of STMicroelectronics BCD Technology

The Evolution of STMicroelectronics BCD Technology

Posted: January 22, 2019 Contributing Author: Sinjin Dixon-Warren, PhD TechInsights’ full analysis of the STMicroelectronics BCD9S referenced in this post is included in our new Power Semiconductor subscription, which addresses new technologies in
January 22, 2019 Jan 22
Google Pixel 3 XL

Google Pixel 3 XL Teardown

Explore the inner workings of the Google Pixel 3 XL through our in-depth teardown analysis. Uncover the key components and technologies powering Google's flagship smartphone, providing valuable insights into its design and performance.
December 10, 2018 Dec 10
Fitbit Charge 3 Teardown

Fitbit Charge 3 Teardown

Posted: December 5, 2018 Contributing Author: Stacy Wegner New Design Win for Cypress Semiconductor As the end of 2018 looms, many people are preparing not only for the gift giving season, but for the onset of their fitness resolutions as well
December 05, 2018 Dec 5

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