Skip to main content
Home TechInsights

User account menu

Sign In Free Sign Up
 
 
TechInsights
×
  • Insights
    • Technologies
    • Topics
    • Capabilities
    • Experts
    • Case Studies

    Strategic Technology Intelligence

    Leverage competitive technical and market intelligence to drive innovation and make informed, strategic product roadmap decisions

    Automotive

    Compute

    Connectivity

    Manufacturing

    Packaging

    Power

    Sensors

    Storage

    Teardown

    Key Industry Topics

    Examine the fundamental topics influencing semiconductor innovation and strategic market decisions.

    Sustainability

    Artificial Intelligence

    Chinese Developments

    Chiplets

    Tariffs

     

    TechInsights Capabilities

    Review how TechInsights supports the Semicondcuctor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

    Reverse Engineering

    Market Analysis

    Cost Analysis

    Intellectual Property Services

     

    Our Experts

    Check out the TechInsights experts that support customers. Detailed technical and market analysis with decades of experience drive innovation for the semidoncutor industry.

    Sustainability

    Reverse Engineering

    Market Analysis

    Advisory

    Spend Insights

     
  • Products
    • Capital Equipment
    • Fabless Semiconductor
    • Foundry
    • Integrated Device Manufacturer
    • Product Manufacturer
    • Government
    • Automotive
    • Mobile Carriers

    Capital Equipment Semiconductor Products

    TechInsights offers predictive process flow analysis for capital equipment, revealing insights into upcoming industry developments from key players.

    Key Features:

    Advanced Packaging

    Customer Satisfaction Survey

    Sensors

    IoT Connectivity SoC

    Compute

    Manufacturing Analysis

    Storage

    Mobile RF

    Power Semiconductors

    Executive Insights

    Fabless Semiconductor Products

    TechInsights offers vital fabless semiconductor insights for competitive chip design optimization.

    Advanced Packaging

    Automotive

    Connected Computing

    Connected/Smart Home

    Executive Insights

    Sensors

    IoT Connectivity SoC

    Compute

    Manufacturing Analysis

    Storage

    Mobile RF

    Power Semiconductors

    Smartphones, Tablets, Wearables

    Foundry Semiconductor Products

    Elevate your foundry's performance with cutting-edge insights and strategic analysis.

    Advanced Packaging

    Automotive

    Consumer Electronics

    Sensors

    IoT Connectivity SoC

    Compute

    Manufacturing Analysis

    Storage

    Mobile RF

    Power Semiconductors

    Smartphones, Tablets, Wearables

    Executive Insights

    Integrated Device Manufacturer Products

    TechInsights empowers Integrated Device Manufacturers with leading semiconductor insights and industry analysis for building winning products.

    Advanced Packaging

    Automotive

    Connected Computing

    Consumer Electronics

    Executive Insights

    Sensors

    IoT Connectivity SoC

    Compute

    Manufacturing Analysis

    Storage

    Power Semiconductors

    Smartphones, Tablets, Wearables

    Product Manufacturer Products

    Elevate your Product Manufacturer's performance with cutting-edge insights and strategic analysis.

    Advanced Packaging

    Connected Computing

    Connected/Smart Home

    Executive Insights

    Sensors

    IoT Connectivity SoC

    Compute

    Manufacturing Analysis

    Storage

    Power Semiconductors

    Procurement

    Smartphones

    Smartphones, Tablets, Wearables

    Government Products

    TechInsights provides unparalleled analysis of semiconductor technologies, supply chains, and intellectual property to support national security, regulatory compliance, and policy development.

    Request a Demo

    Contact Sales

    Automotive Products

    TechInsights equips you with the insights you need to successfully navigate the automotive semiconductor market.

    Executive Insights

    Market Opportunity

    Module Innovation

    Procurement

    Semiconductor Innovation

    Supply Chain

     

    Mobile Carrier Products

    TechInsights’ Mobile Carriers product delivers in-depth analysis and data-driven insights into the strategies of global mobile network operators.

    Request a Demo

    Contact Sales

    Add-ons

    Providing supplementary features and functionalities, enhancing the capabilities of the core TechInsights product or service.

    EcoInsights

    High Performance Computing

    Semiconductor Manufacturing Economics

    BOM Database and BOM Database with Subsystems

    Component Price Landscape (CPL)

    Component Price Analyzer (CPA)

    Handset Cost Model

    Customer Satisfaction Survey

  • Resources
    • Blogs
    • Webinars
    • Featured Reports
    • Podcast
    • Our Experts
    • Case Studies

    Editor's Picks

    TechInsights Tariff Watch: Navigate the Impact of Global Tariffs on Technology

    Maximize Wafer Efficiency with TechInsights’ Die Calculator

    Sign Up for the Latest Webinar

    Semiconductor Manufacturing in the AI Era: Who’s Leading the Charge?

    Explore Key Trends, Market Leaders, and AI-Driven Growth in Semiconductor Equipment

     
  • Company

    About Us

    Investments

    Careers

    Community Involvement

    Contact Us

  • Careers
Home TechInsights

User account menu

Sign In Free Sign Up
  1. Home
  2. Newsroom
Apple U1 UWB Chip

Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis

One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directional
October 24, 2019 Oct 24
Apple 1720 Charger

Inside the Apple 1720 Charger included with the iPhone 11 Pro Max

Posted: September 27, 2019 Contributing Author: Sinjin Dixon-Warren The iPhone 11 Pro Max ships with the Apple 1720 18 W USB-C power delivery charger. This device is rated to delivery 5 V and 3 A or 9 V and 2 A. In follow up to our recent blog
September 27, 2019 Sep 27
iPhone 11 Pro Max

Apple iPhone 11 Pro Max Teardown

Posted: September 23, 2019 - Updated: October 1, 2019 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple event
September 23, 2019 Sep 23
GaN, SiC, and Si technologies in AC Adapters

GaN, SiC, and Si technologies in AC Adapters

Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device
August 14, 2019 Aug 14
Huawei Mate 20 X Teardown

Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown

2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung
August 02, 2019 Aug 2
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)

Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)

4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image
July 30, 2019 Jul 30
Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)

Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)

4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the
July 23, 2019 Jul 23
Part 2: Pixel Scaling and Scaling Enablers

Part 2: Pixel Scaling and Scaling Enablers

4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop
July 16, 2019 Jul 16
Part 1: Chip-stacking and chip-to-chip interconnect

Part 1: Chip-stacking and chip-to-chip interconnect

4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image
July 09, 2019 Jul 9
TechInsights memory technology update from IEDM18

TechInsights memory technology update from IEDM18

Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees
April 11, 2019 Apr 11
Samsung Galaxy S10 5G Teardown

Samsung Galaxy S10 5G Teardown

Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world
April 09, 2019 Apr 9
Analyzing innovations in mobile radio frequency front-end integration

Analyzing innovations in mobile radio frequency front-end integration

Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support
April 09, 2019 Apr 9
Samsung Galaxy S10+ Teardown

Samsung Galaxy S10+ Teardown

EXPERIENCE THE WEBINAR The Samsung Galaxy S23 Ultra - Inside the Flagship April 5, 2023 In this exclusive webinar, our experts will deliver an in-depth analysis of the components within this device, highlight what changed from previous versions, and
March 01, 2019 Mar 1
Lenovo Brings the New Snapdragon to Market

Lenovo Brings the New Snapdragon to Market

Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell
February 20, 2019 Feb 20
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger

Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger

Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to
February 07, 2019 Feb 7
Tesla poised to apply Maxwell’s dry electrode innovation to battery cell fabrication

Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication

Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and
February 07, 2019 Feb 7

Pagination

  • « First First page
  • ‹ Previous Previous page
  • …
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • …
  • Next › Next page
  • Last » Last page