TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content OTTAWA, ON, October 14, 2021 - TechInsights Inc. is pleased to announce the acquisition of The Linley Group, Inc., an industry-leading source for independent technology analysis of the latest

YMTC 128L Xtacking 2.0 for SSD! Finally, they might catch up with Samsung, SK hynix, and KIOXIA Dr. Jeongdong Choe September 23, 2021 TechInsights just found and quickly reviewed YMTC 128L TLC die removed from Asgard Memory (Powev Electronic Technology Co.) PCIe4.0 NVMe1.4 AN4 1TB SSD with a double

We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below.

Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm eMRAM products with STT-MRAM technology and

NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND

Power Semiconductor Technology Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer a place for silicon (Si) in power electronics

DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as well. One of DDR5 DIMM products has been confirmed

DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first sub-15nm cell integrated DRAM product. Micron Z41C

Teardown Technology Stacy Wegner How many mini-LEDs did Apple pack into the iPad Pro? An in-depth look at the Liquid Retina XDR display Note: this article provides an update to the Displays section of our lengthier article on the TechInsights teardown of the Apple iPad Pro, originally published in

Embedded and Emerging Memory Technology Here, we have the Intel 2 nd gen. XPoint Memory die! Finally, we’ve found the Intel XPoint TM Memory 2nd generation die! We’ve quickly viewed the die removed from Intel OptaneTM SSD DC P5800X 400GB (Model: SSDPF21Q400GB) which consists of eight storage devices

This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.