MediaTek’s Dimensity 1050 chipset is making 5G mmWave support in smartphones more affordable. Until now, only top tier US devices were equipped with 5G mmWave capabilities.

Security and surveillance camera equipment is frequently required to perform in challenging lighting conditions. Based on multiple customers demands for performance upgrades to their STARVIS system, Sony have developed the IMX662, the latest from the STARVIS 2 family of image sensors.

Samsung’s HKMG DDR5 is the most advanced DRAM product available. Based on the successes of this device design, HKMG is likely set to become the new standard in DRAM manufacturing. Learn more about this technology innovation here.

TechInsights has just received the Motorola Moto X30 Pro (XT2241-1) smartphone and launched an analysis on its wide-angle rear camera, confirming the Samsung HP1.

Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies. Our analysis also uncovered many similarities between the SMIC 7nm and the TSMC 7nm, which are available in our comparison brief.

TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.

Both leading foundries allowed customers to claim they were using a 4nm process when, in fact, they were using 5nm technology. This situation renders node names meaningless. Featured in our July 22 Microprocessor Report we are making this available, in full, for a limited time.

A collaboration between Dr. Stephen Russell (TechInsights) and Prof. Peter Gammon (PGC). ROHM released their 4th generation (Gen 4) MOSFET products this year. The new range includes MOSFETs rated to 750 V (increased from 650V) and 1200 V, with a number of the available TO247 packaged components automotive qualified up to 56A/24mΩ.

New ROHM 4th Generation SiC MOSFETs Featuring the Industry’s Lowest ON Resistance. Download the product brief for more details, and for a high-resolution image showing the trench structure with annotations.

The Samsung Galaxy S22 Ultra has the latest and greatest Qualcomm mmWave, but not in Europe...

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm eMRAM products with STT-MRAM technology and

NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND