Qualcomm PM8150 Advanced Packaging Essentials

PM8150 fan-in wafer level package (FI-WLP) built using Deca Technology's packaging technology
Product Code
APE-1905-801
Release Date
09/07/2019
Availability
Published
Product Item Code
QUA-PM8150
Device Manufacturer
Qualcomm
Device Type
Power Management IC
Subscription
Packaging
Channel
Advanced Packaging - Process
Report Code
APE-1905-801
This is an Advanced Packaging Essentials (APE) summary document for the PM8150 fan-in wafer level package (FI-WLP) built using Deca's packaging technology, The complete APE deliverable includes: concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:
  • Downstream product teardown
  • Package photographs and X-rays
  • Die photographs
  • Optical planar view images of the redistribution layers (RDLs)
  • SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias
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