Qualcomm PM8150 Advanced Packaging Essentials

This is an Advanced Packaging Essentials (APE) summary document for the PM8150 fan-in wafer level package (FI-WLP) built using Deca's packaging technology, The complete APE deliverable includes: concise analyst’s summary of critical device metrics, scanning electron microscopy (SEM) based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:

• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical planar view images of the redistribution layers (RDLs)
• SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias