GaN GS66508B/GS66508T Embedded Die Package Advanced Packaging Essentials

Product Code
APE-2002-801
Release Date
22/07/2020
Availability
Published
Product Item Code
GAN-GS66508T_die
Device Manufacturer
GAN Systems
Subscription
Packaging
Channel
Advanced Packaging - Process
Report Code
APE-2002-801
This is an Advanced Packaging Essentials of the GaN Systems GS66508T and GS66508B 650 V E-mode GaN transistor embedded die package technology. Each of the GS66508T and GS66508B components is an enhancement mode GaN-on-silicon power transistor and uses embedded die package technology. The power transistor die is fully embedded in a two-layer printed wiring board (PWB).
  • Downstream product teardown
  • Package photographs and X-rays
  • Die photographs
  • Optical planar view images of the redistribution layers (RDLs)
  • SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.

Don't miss another update from TechInsights.

All our latest content updates sent to you a few times a month.