GaN GS66508B/GS66508T Embedded Die Package Advanced Packaging Essentials

Product Code
APE-2002-801
Release Date
Availability
In Creation
Product Item Code
GAN-GS66508T_die
Device Manufacturer
GAN Systems
Subscription
Packaging
Channel
Advanced Packaging - Process
Report Code
APE-2002-801
GaNPX technology should reveal the following key elements: • Power IC fully embedded in a printed-wiring board (PWB) • Thermal vias for heat conduction • Compact and highly thermally efficient package structure Designed for power application, this technology can certainly be used for other applications.
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