Intel SR3RM HBM2 EMIB ACMOS Essentials - Advanced Packaging

The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

• Package photographs and X-rays
• Top metal die photographs
• Optical cross section of general package structure
• SEM cross section of the general package structure, metals, dielectric materials, die and package interconnect
• Scanning electron microscopy (SEM) cross section of EMIB structure and die to EMIB interconnect
  

The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.