Samsung Exynos 9110 Samsung Fan-Out Panel Level Packaging - Advanced Packaging Essentials

Product Code
ACE-1810-803
Release Date
28/01/2019
Availability
Published
Product Item Code
SAM-SM-R810
Device Manufacturer
Samsung
Device Type
Smartwatch
Subscription
Packaging
Channel
Advanced Packaging - Process
Report Code
ACE-1810-803
This is an Advanced CMOS Essentials (APE) Summary document of the fan-out panel level package (FO-PLP) built using Samsung’s next generation of semiconductor packaging technology. Concise analyst’s summary of critical device metrics, scanning electron microscopy based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:
  • Downstream product teardown
  • Package photographs and X-rays
  • Die photographs
  • Optical planar view images of the redistribution layers (RDLs) and the embedded printed wiring board (PWB)
  • SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, embedded PWB and PoP interconnect
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.

Don't miss another update from TechInsights.

All our latest content updates sent to you a few times a month.