Unlocking Insights: SoC Design Analysis Q1 2024 Briefing

This briefing features key innovations in the latest new technologies: TSMC 3 nm and Intel 4 nm, and the disruptive SMIC 7 nm N+2, through the lens of digital gates and standard cell libraries. Discover our latest benchmarking on scaling and transistor density metrics of leading flagship SoCs like the Apple A17, HiSilicon Kirin 9010, and MediaTek Dimensity 9200.
29Apr

HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra

HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra Discover the groundbreaking technology behind Huawei's Pura 70 Ultra smartphone, powered by the innovative HiSilicon Kirin 9010 processor. Delve into our in-depth analysis by the TechInsights team, uncovering the intricacies of the processor and
26Apr

Huawei Pura 70 Ultra Teardown

Uncover the secrets of the Huawei Pura Ultra 70 with our in-depth teardown analysis. From the Kirin 9010 chipset to the innovative camera system, learn what sets this device apart.
23Apr

Renesas MCU Tests RISC-V Demand

Renesas is testing demand for RISCV-based microcontrollers, introducing the first of what could be a series of such processors, the R9A02G021, targeting low-cost applications.
22Apr

A Tale of Three Phone Chips: Eco Edition

TechInsights discovered a 20% gap in carbon emissions from manufacturing the semiconductors of three flagship phones, despite smartphones being typically evaluated based on screen size, processor speed, and camera resolution.
21Apr