Outlook Summit Series
TechInsights’ 2026 Outlook Summit brings together leading semiconductor experts to decode the year ahead.
Join TechInsights’ expert analysts in our 12 exclusive webinars, each focused on a key market segment, to gain actionable insights for strategists, designers, foundry managers, and executives. Each session is packed with actionable insights, forecasts, and competitive analysis to help you plan with confidence. Designed to support strategic planning and decision-making, each session delivers the information teams need to stay informed and competitive.
Don’t just react to the market—lead it.
The semiconductor and technology markets are evolving faster than ever. From AI acceleration to emerging power technologies, memory scaling, connectivity innovation, and consumer electronics trends, 2026 promises both unprecedented opportunities and challenges.
5 Expectations for the PC/Laptop/Tablet Market in 2026
Examine the PC, laptop, and tablet market in 2026 with insights into on-device AI expansion, tariff impacts on pricing, mid-market growth opportunities, emerging processor alternatives (HiSilicon Kirin, RISC-V), and shifting dynamics between x86 and Arm.
Register in 1 Click
Sessions:
December 9, 2025 - 11:00 AM EST
December 10, 2025 – 10:00 AM JST/KST
Duration: 1 hour
Eric Smith
Director, Connected Computing Devices Research
Stacy Wegner
Senior Technology Analyst
Anand Joshi
AI Technology Analyst
Dr. Porter Seo
Senior Technical Fellow, Logic
5 Expectations for the Consumer Electronics Market in 2026
Gain visibility into the consumer electronics market in 2026 with insights on AI-enabled devices, smart home convergence, shifts in wearable demand, content-driven display upgrades, and sustainability reshaping global supply chains.
Register in 1 Click
Sessions:
December 16, 2025 - 11:00 AM EST
December 17, 2025 – 10:00 AM JST/KST
Duration: 1 hour
Jack Narcotta
Head of Consumer Electronics Market Analysis
Stacy Wegner
Senior Technology Analyst
Nitesh Patel
Director of Smart Home Strategies
Radu Trandafir
Subject Matter Expert/Technical Fellow – Mobile RF and Wi-Fi/IoT Technical Analysis
5 Expectations for the Manufacturing Market in 2026
Understand the semiconductor manufacturing market in 2026 with insights on TSMC’s 2nm production scale-up, China’s export control and emissions challenges, AI-driven inventory strategies, glass substrates for high-performance chips, and wafer fab equipment growth across Asia.
Register in 1 Click
Sessions:
January 14, 2026 - 11:00 AM EST
January 15, 2026 – 10:00 AM JST/KST
Duration: 1 hour
Boris Metodiev
Director of Semiconductor Manufacturing Analysis
Stephen Russell
Senior Technical Fellow
Thomas “Gray” Stephenson
Senior Analyst
Cameron McKnight-MacNeil
Process Analyst
5 Expectations for the Mobile Market in 2026
Explore the mobile market in 2026, including mobile-AI integration, SoC and DRAM innovation, tariff and trade disruptions, new device form factors, and rising demand from BRIC and emerging markets.
Register in 1 Click
Sessions:
January 21, 2026 - 11:00 AM EST
January 22, 2026 – 10:00 AM JST/KST
Duration: 1 hour
Wayne Lam
Principal Analyst, Device Technologies
Ken Hyers
Director, Device Technologies
Linda Sui
Head of Mobile End Markets
Radu Trandafir
Subject Matter Expert/Technical Fellow – Mobile RF and Wi-Fi/IoT Technical Analysis
Previous 5 Expectations in 2026 Series:
5 Expectations for the AI Market
Gain insights into the AI market in 2026, including how AI models and workloads are evolving, datacenter vs. edge opportunities, power-driven innovations such as 2nm and CPO, and the impact of US-China tensions on the global AI chip industry.
5 Expectations for the Power Market
Explore the future of the power semiconductor market in 2026 with analysis of datacenter demand, the $4B power conversion opportunity, SiC oversupply, GaN disruption, PMIC innovation, and China’s wide-bandgap strategy.
5 Expectations for the Memory Market
Uncover key trends in the memory market in 2026—AI workload growth, HBM4 adoption, 3D NAND scaling with 300+ layers and hybrid bonding, shifting DRAM/NAND demand, and the influence of geopolitical and export control policies.
5 Expectations for the Sensor Market
Understand the sensor market in 2026 with insights into 8K smartphone video, 200MP+ image sensor architectures, AI at the edge, and China’s supply chain strategies that are reshaping global competition.
5 Expectations for the Compute Market
Get ahead of 2026 compute shifts with insights on datacenter accelerator momentum, next-gen node transitions, chiplet adoption, end-market cycle risks, and China’s race for processor independence.
5 Expectations for the Connectivity Market
Gain a strategic view of 2026 connectivity, spanning 5G densification, ambient compute evolution, RF innovation, satellite and IoT growth, and China’s accelerating RF leadership in global supply chains.
5 Expectations for the Automotive Market
Track the automotive semiconductor market in 2026, including evolving vehicle architectures, 48V/800V standards, the expanding role of AI in vehicles, China’s demand growth, and the effects of tariffs and trade policies on global supply chains.
5 Expectations for the Advanced Packaging Market
Analyze the advanced packaging market in 2026, with coverage of co-packaged optics adoption, HBM demand from AI, the shift to panel and glass substrates, thermal challenges in 3D stacking, and chiplet integration for mobile devices.
Reserve Your Spot Today – Limited Seats Available
Whether you’re a strategist, chip designer, foundry manager, investor, or executive, these sessions will give you the insights you need to anticipate change, align your roadmap, and stay ahead of disruption.
Cost Explorer: Optimizing PPACtE for Semiconductor R&D
TechInsights’ Cost Explorer adds cost, cycle time, and carbon modeling to Synopsys DTCO workflows, enabling full PPACtE optimization before costly test wafers.
Sony Launches First 200MP Smartphone Sensor: LYTIA 901
Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
The Authoritative Information Platform to the Semiconductor Industry.
